CY7C1511AV18, CY7C1526AV18
CY7C1513AV18, CY7C1515AV18
72-Mbit QDR™-II SRAM 4-Word
Burst Architecture
Features
Configurations
■ Separate independent read and write data ports
❐ Supports concurrent transactions
CY7C1511AV18 – 8M x 8
CY7C1526AV18 – 8M x 9
CY7C1513AV18 – 4M x 18
CY7C1515AV18 – 2M x 36
■ 300 MHz clock for high bandwidth
■ 4-word burst for reducing address bus frequency
Functional Description
■ DoubleDataRate(DDR)interfacesonbothreadandwriteports
(data transferred at 600 MHz) at 300 MHz
The CY7C1511AV18, CY7C1526AV18, CY7C1513AV18, and
CY7C1515AV18 are 1.8V Synchronous Pipelined SRAMs,
equipped with QDR™-II architecture. QDR-II architecture
consists of two separate ports: the read port and the write port to
access the memory array. The read port has dedicated data
outputs to support read operations and the write port has
dedicated data inputs to support write operations. QDR-II archi-
tecture has separate data inputs and data outputs to completely
eliminate the need to “turn-around” the data bus that exists with
common IO devices. Each port can be accessed through a
common address bus. Addresses for read and write addresses
are latched on alternate rising edges of the input (K) clock.
Accesses to the QDR-II read and write ports are completely
independent of one another. To maximize data throughput, both
read and write ports are equipped with DDR interfaces. Each
address location is associated with four 8-bit words
(CY7C1511AV18), 9-bit words (CY7C1526AV18), 18-bit words
(CY7C1513AV18), or 36-bit words (CY7C1515AV18) that burst
sequentially into or out of the device. Because data can be trans-
ferred into and out of the device on every rising edge of both input
clocks (K and K and C and C), memory bandwidth is maximized
while simplifying system design by eliminating bus
“turn-arounds”.
■ Two input clocks (K and K) for precise DDR timing
❐ SRAM uses rising edges only
■ Two input clocks for output data (C and C) to minimize clock
skew and flight time mismatches
■ Echo clocks (CQ and CQ) simplify data capture in high-speed
systems
■ Single multiplexed address input bus latches address inputs
for read and write ports
■ Separate port selects for depth expansion
■ Synchronous internally self-timed writes
■ QDR-II operates with 1.5 cycle read latency when the Delay
Lock Loop (DLL) is enabled
■ Operates as a QDR-I device with 1 cycle read latency in DLL
off mode
■ Available in x 8, x 9, x 18, and x 36 configurations
■ Full data coherency, providing most current data
■ Core VDD = 1.8 (± 0.1V); IO VDDQ = 1.4V to VDD
■ Available in 165-Ball FBGA package (15 x 17 x 1.4 mm)
■ Offered in both Pb-free and non Pb-free packages
■ Variable drive HSTL output buffers
Depth expansion is accomplished with port selects, which
enables each port to operate independently.
All synchronous inputs pass through input registers controlled by
the K or K input clocks. All data outputs pass through output
registers controlled by the C or C (or K or K in a single clock
domain) input clocks. Writes are conducted with on-chip
synchronous self-timed write circuitry.
■ JTAG 1149.1 compatible test access port
■ Delay Lock Loop (DLL) for accurate data placement
Selection Guide
Description
300 MHz
300
278 MHz
278
250 MHz
250
200 MHz
200
167 MHz
167
Unit
MHz
mA
Maximum Operating Frequency
Maximum Operating Current
x8
x9
930
865
790
655
570
940
870
795
660
575
x18
x36
1020
1230
950
865
715
615
1140
1040
850
725
Cypress Semiconductor Corporation
Document Number: 001-06985 Rev. *C
•
198 Champion Court
•
San Jose, CA 95134-1709
•
408-943-2600
Revised September 27, 2007
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