是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Active | 零件包装代码: | QFP |
包装说明: | 14 X 20 MM, 1.40 MM HEIGHT, LEAD FREE, PLASTIC, MS-026, TQFP-100 | 针数: | 100 |
Reach Compliance Code: | unknown | 风险等级: | 5.76 |
最长访问时间: | 3 ns | 其他特性: | PIPELINED ARCHITECTURE |
JESD-30 代码: | R-PQFP-G100 | JESD-609代码: | e3/e4 |
长度: | 20 mm | 内存密度: | 75497472 bit |
内存集成电路类型: | ZBT SRAM | 内存宽度: | 36 |
湿度敏感等级: | 3 | 功能数量: | 1 |
端子数量: | 100 | 字数: | 2097152 words |
字数代码: | 2000000 | 工作模式: | SYNCHRONOUS |
最高工作温度: | 70 °C | 最低工作温度: | |
组织: | 2MX36 | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | LQFP | 封装形状: | RECTANGULAR |
封装形式: | FLATPACK, LOW PROFILE | 并行/串行: | PARALLEL |
峰值回流温度(摄氏度): | 260 | 认证状态: | COMMERCIAL |
座面最大高度: | 1.6 mm | 最大供电电压 (Vsup): | 2.625 V |
最小供电电压 (Vsup): | 2.375 V | 标称供电电压 (Vsup): | 2.5 V |
表面贴装: | YES | 温度等级: | COMMERCIAL |
端子面层: | MATTE TIN/NICKEL PALLADIUM GOLD | 端子形式: | GULL WING |
端子节距: | 0.65 mm | 端子位置: | QUAD |
处于峰值回流温度下的最长时间: | 20 | 宽度: | 14 mm |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
CY7C1470V25-250AXCT | CYPRESS |
获取价格 |
ZBT SRAM, 2MX36, 3ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, LEAD FREE, PLASTIC, MS-02 | |
CY7C1470V25-250AXI | CYPRESS |
获取价格 |
72-Mbit(2M x 36/4M x 18/1M x 72) Pipelined SR | |
CY7C1470V25-250BZC | CYPRESS |
获取价格 |
72-Mbit(2M x 36/4M x 18/1M x 72) Pipelined SR | |
CY7C1470V25-250BZC | ROCHESTER |
获取价格 |
2MX36 ZBT SRAM, 3ns, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, FBGA-165 | |
CY7C1470V25-250BZI | CYPRESS |
获取价格 |
72-Mbit(2M x 36/4M x 18/1M x 72) Pipelined SR | |
CY7C1470V25-250BZXC | CYPRESS |
获取价格 |
72-Mbit(2M x 36/4M x 18/1M x 72) Pipelined SR | |
CY7C1470V25-250BZXI | CYPRESS |
获取价格 |
72-Mbit(2M x 36/4M x 18/1M x 72) Pipelined SR | |
CY7C1470V33 | CYPRESS |
获取价格 |
72-Mbit (2M x 36/4M x 18/1M x 72) Pipelined SRAM with NoBL Architecture | |
CY7C1470V33_06 | CYPRESS |
获取价格 |
72-Mbit (2M x 36/4M x 18/1M x 72) Pipelined S | |
CY7C1470V33_13 | CYPRESS |
获取价格 |
72-Mbit (2 M x 36/4 M x 18/1 M x 72) Pipeline |