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CY7C1461V33-133BZC PDF预览

CY7C1461V33-133BZC

更新时间: 2024-01-27 04:22:20
品牌 Logo 应用领域
赛普拉斯 - CYPRESS 时钟静态存储器内存集成电路
页数 文件大小 规格书
26页 472K
描述
ZBT SRAM, 1MX36, 6.5ns, CMOS, PBGA165, 15 X 17 MM, 1.20 MM HEIGHT, FBGA-165

CY7C1461V33-133BZC 技术参数

是否无铅: 含铅是否Rohs认证: 不符合
生命周期:Obsolete零件包装代码:BGA
包装说明:15 X 17 MM, 1.20 MM HEIGHT, FBGA-165针数:165
Reach Compliance Code:compliantECCN代码:3A991.B.2.A
HTS代码:8542.32.00.41风险等级:5.92
最长访问时间:6.5 ns其他特性:FLOW-THROUGH ARCHITECTURE
最大时钟频率 (fCLK):133 MHzI/O 类型:COMMON
JESD-30 代码:R-PBGA-B165JESD-609代码:e0
长度:17 mm内存密度:37748736 bit
内存集成电路类型:ZBT SRAM内存宽度:36
湿度敏感等级:3功能数量:1
端子数量:165字数:1048576 words
字数代码:1000000工作模式:SYNCHRONOUS
最高工作温度:70 °C最低工作温度:
组织:1MX36输出特性:3-STATE
封装主体材料:PLASTIC/EPOXY封装代码:TBGA
封装等效代码:BGA165,11X15,40封装形状:RECTANGULAR
封装形式:GRID ARRAY, THIN PROFILE并行/串行:PARALLEL
峰值回流温度(摄氏度):220电源:2.5/3.3,3.3 V
认证状态:Not Qualified座面最大高度:1.2 mm
最大待机电流:0.015 A最小待机电流:3.14 V
子类别:SRAMs最大供电电压 (Vsup):3.465 V
最小供电电压 (Vsup):3.135 V标称供电电压 (Vsup):3.3 V
表面贴装:YES技术:CMOS
温度等级:COMMERCIAL端子面层:Tin/Lead (Sn/Pb)
端子形式:BALL端子节距:1 mm
端子位置:BOTTOM处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:15 mmBase Number Matches:1

CY7C1461V33-133BZC 数据手册

 浏览型号CY7C1461V33-133BZC的Datasheet PDF文件第2页浏览型号CY7C1461V33-133BZC的Datasheet PDF文件第3页浏览型号CY7C1461V33-133BZC的Datasheet PDF文件第4页浏览型号CY7C1461V33-133BZC的Datasheet PDF文件第5页浏览型号CY7C1461V33-133BZC的Datasheet PDF文件第6页浏览型号CY7C1461V33-133BZC的Datasheet PDF文件第7页 
CY7C1461V33  
CY7C1463V33  
CY7C1465V33  
PRELIMINARY  
1Mx36/2Mx18/512Kx72Flow-ThruSRAM  
with NoBL™ Architecture  
BWSc,BWSd,BWSe, BWSf, BWSg, BWSh), and Read-Write  
control (WE). BWSc and BWSd apply to CY7C1461V33 and  
CY7C1465V33 only. BWSe, BWSf, BWSg and BWSh apply to  
CY7C1465V33 only  
Features  
• Zero Bus Latency , no dead cycles between Write and  
Read cycles  
•Supports 133-MHz bus operations  
•1M × 36/2M × 18/512K × 72 common I/O  
•Fast clock-to-output times  
— 6.5 ns (for 133-MHz device)  
— 7.5 ns (for 117-MHz device)  
A
Clock Enable (CEN) pin allows operation of the  
CY7C1461V33, CY7C1463V33, and CY7C1465V33 to be  
suspended as long as necessary. All synchronous inputs are  
ignored when (CEN) is high and the internal device registers  
will hold their previous values.  
There are three Chip Enable (CE1, CE2, CE3) pins that allow  
the user to deselect the device when desired. If any one of  
these three are not active when ADV/LD is low, no new  
memory operation can be initiated and any burst cycle in  
progress is stopped. However, any pending data transfers  
(READ or WRITE) will be completed. The data bus will be in  
high impedance state two cycles after chip is deselected or a  
Write cycle is initiated.  
• Single 3.3V –5% and +5% power supply VDD  
• Separate VDDQ for 3.3V or 2.5V  
• Clock Enable (CEN) pin to suspend operation  
• Burst Capability–linear or interleaved burst order  
• Available in 119-ball bump BGA, 165-ball FBGA, and  
100-pin TQFP packages (CY7C1461V33 and  
CY7C1463V33). 209-ball FBGA package for  
CY7C1465V33.  
The CY7C1461V33, CY7C1463V33 and CY7C1465V33 have  
an on-chip two-bit burst counter. In the burst mode,  
CY7C1461V33, CY7C1463V33 and CY7C1465V33 provide  
four cycles of data for a single address presented to the  
SRAM. The order of the burst sequence is defined by the  
MODE input pin. The MODE pin selects between linear and  
interleaved burst sequence. The ADV/LD signal is used to load  
a new external address (ADV/LD = LOW) or increment the  
internal burst counter (ADV/LD = HIGH)  
Functional Description  
The CY7C1461V33, CY7C1463V33 and CY7C1465V33  
SRAMs are designed to eliminate dead cycles when transi-  
tions from Read to Write or vice versa. These SRAMs are  
optimized for 100% bus utilization and achieve Zero Bus  
Latency. They integrate 1,048,576 × 36/2,097,152 × 18/  
524,288 × 72 SRAM cells, respectively, with advanced  
synchronous peripheral circuitry and a two-bit counter for  
internal burst operation. The Synchronous Burst SRAM family  
employs high-speed, low-power CMOS designs using  
advanced single layer polysilicon, threelayer metal  
technology. Each memory cell consists of six transistors.  
Output Enable (OE) and burst sequence select (MODE) are  
the asynchronous signals. OE can be used to disable the  
outputs at any given time. ZZ may be tied to LOW if it is not  
used.  
Four pins are used to implement JTAG test capabilities. The  
JTAG circuitry is used to serially shift data to and from the  
device. JTAG inputs use LVTTL/LVCMOS levels to shift data  
during this testing mode of operation.  
All synchronous inputs are gated by registers controlled by a  
positive-edge-triggered Clock Input (CLK). The synchronous  
inputs include all addresses, all data inputs, depth-expansion  
Chip Enables (CE1, CE2 and CE3), cycle start input (ADV/LD),  
Clock Enable (CEN), Byte Write Selects (BWSa, BWSb,  
Logic Block Diagram  
D
CLK  
Data-In REG.  
CE  
Q
ADV/LD  
A
x
CEN  
CE  
CONTROL  
and WRITE  
LOGIC  
1M × 36  
1
2M × 18  
CE  
2
512K × 72  
Memory  
Array  
DQ  
x
CE  
DQ  
3
A
BWS  
X
DP  
X
X
X
DP  
WE  
x
BWS  
X = a, b  
, c, d  
x
X= a, b,  
c, d  
X = a, b,  
c, d  
X = 19:0  
X = 20:0  
1M×36  
Mode  
X = a, b  
X = a, b X = a, b  
2M×18  
X = a, b  
X = a, b,  
X = a, b,  
c,d,e,f,g,h  
c,d,e,f,g,h  
X = 18:0  
512K×72  
OE  
c,d,e,f,g,h  
Cypress Semiconductor Corporation  
3901 North First Street  
San Jose  
CA 95134  
408-943-2600  
Document #: 38-05193 Rev. *B  
Revised November 18, 2002  

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