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CY7C1356A-133AC PDF预览

CY7C1356A-133AC

更新时间: 2024-11-08 05:19:15
品牌 Logo 应用领域
赛普拉斯 - CYPRESS 存储内存集成电路静态存储器时钟
页数 文件大小 规格书
28页 403K
描述
256K x 36/512K x 18 Pipelined SRAM with NoBL⑩ Architecture

CY7C1356A-133AC 技术参数

是否Rohs认证:不符合生命周期:Obsolete
零件包装代码:QFP包装说明:14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100
针数:100Reach Compliance Code:not_compliant
ECCN代码:3A991.B.2.AHTS代码:8542.32.00.41
风险等级:5.18Is Samacsys:N
最长访问时间:4.2 ns其他特性:PIPELINED ARCHITECTURE
最大时钟频率 (fCLK):133 MHzI/O 类型:COMMON
JESD-30 代码:R-PQFP-G100JESD-609代码:e0
长度:20 mm内存密度:9437184 bit
内存集成电路类型:ZBT SRAM内存宽度:18
湿度敏感等级:3功能数量:1
端子数量:100字数:524288 words
字数代码:512000工作模式:SYNCHRONOUS
最高工作温度:70 °C最低工作温度:
组织:512KX18输出特性:3-STATE
封装主体材料:PLASTIC/EPOXY封装代码:LQFP
封装等效代码:QFP100,.63X.87封装形状:RECTANGULAR
封装形式:FLATPACK, LOW PROFILE并行/串行:PARALLEL
峰值回流温度(摄氏度):225电源:2.5/3.3,3.3 V
认证状态:Not Qualified座面最大高度:1.6 mm
最大待机电流:0.03 A最小待机电流:3.14 V
子类别:SRAMs最大压摆率:0.41 mA
最大供电电压 (Vsup):3.465 V最小供电电压 (Vsup):3.135 V
标称供电电压 (Vsup):3.3 V表面贴装:YES
技术:CMOS温度等级:COMMERCIAL
端子面层:Tin/Lead (Sn/Pb)端子形式:GULL WING
端子节距:0.65 mm端子位置:QUAD
处于峰值回流温度下的最长时间:30宽度:14 mm
Base Number Matches:1

CY7C1356A-133AC 数据手册

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CY7C1354A  
CY7C1356A  
256K x 36/512K x 18 Pipelined SRAM  
with NoBL™ Architecture  
All synchronous inputs are gated by registers controlled by a  
positive-edge-triggered clock input (CLK). The synchronous  
Features  
• Zero Bus Latency™, no dead cycles between Write and  
inputs include all addresses, all data inputs, depth-expansion  
Chip Enables (CE, CE2, and CE3), Cycle Start Input (ADV/LD),  
Clock Enable (CEN), Byte Write Enables (BWa, BWb, BWc,  
and BWd), and Read-Write Control (WEN). BWc and BWd  
apply to CY7C1354A only.  
Address and control signals are applied to the SRAM during  
one clock cycle, and two cycles later, its associated data  
occurs, either Read or Write.  
Read cycles  
• Fast clock speed: 200, 166, 133, 100 MHz  
• Fast access time: 3.2, 3.6, 4.2, 5.0 ns  
• Internally synchronized registered outputs eliminate  
the need to control OE  
• Single 3.3V –5% and +5% power supply VCC  
• Separate VCCQ for 3.3V or 2.5V I/O  
A
clock enable (CEN) pin allows operation of the  
CY7C1354A/CY7C1356A to be suspended as long as  
necessary. All synchronous inputs are ignored when (CEN) is  
HIGH and the internal device registers will hold their previous  
values.  
• Single WEN (Read/Write) control pin  
• Positive clock-edge triggered, address, data, and  
control signal registers for fully pipelined applications  
• Interleaved or linear four-word burst capability  
There are three chip enable pins (CE, CE2, CE3) that allow the  
user to deselect the device when desired. If any one of these  
three are not active when ADV/LD is LOW, no new memory  
operation can be initiated and any burst cycle in progress is  
stopped. However, any pending data transfers (Read or Write)  
will be completed. The data bus will be in high-impedance  
state two cycles after chip is deselected or a Write cycle is  
initiated.  
The CY7C1354A and CY7C1356A have an on-chip two-bit  
burst counter. In the burst mode, the CY7C1354A and  
CY7C1356A provide four cycles of data for a single address  
presented to the SRAM. The order of the burst sequence is  
defined by the MODE input pin. The MODE pin selects  
between linear and interleaved burst sequence. The ADV/LD  
signal is used to load a new external address (ADV/LD = LOW)  
or increment the internal burst counter (ADV/LD = HIGH)  
Output Enable (OE), Sleep Enable (ZZ) and burst sequence  
select (MODE) are the asynchronous signals. OE can be used  
to disable the outputs at any given time. ZZ may be tied to  
LOW if it is not used.  
Four pins are used to implement JTAG test capabilities. The  
JTAG circuitry is used to serially shift data to and from the  
device. JTAG inputs use LVTTL/LVCMOS levels to shift data  
during this testing mode of operation.  
• Individual byte Write (BWa–BWd) control (may be tied  
LOW)  
• CEN pin to enable clock and suspend operations  
• Three chip enables for simple depth expansion  
• Automatic power-down feature available using ZZ  
mode or CE select  
• JTAG boundary scan  
• Low-profile 119-bump, 14-mm × 22-mm BGA (Ball Grid  
Array), and 100-pin TQFP packages  
Functional Description  
The CY7C1354A and CY7C1356A SRAMs are designed to  
eliminate dead cycles when transitioning from Read to Write  
or vice versa. These SRAMs are optimized for 100% bus utili-  
zation and achieve Zero Bus Latency(ZBL)/No Bus  
Latency(NoBL). They integrate 262,144 × 36 and 524,288  
× 18 SRAM cells, respectively, with advanced synchronous  
peripheral circuitry and a two-bit counter for internal burst  
operation. These employ high-speed, low-power CMOS  
designs using advanced triple-layer polysilicon, double-layer  
metal technology. Each memory cell consists of four  
transistors and two high-valued resistors.  
Selection Guide  
7C1354A-166  
7C1356A-166  
7C1354A-133  
7C1356A-133  
7C1354A-200  
3.2  
7C1356A-100 Unit  
Maximum Access Time  
3.6  
480  
30  
4.2  
410  
30  
5.0  
350  
30  
ns  
mA  
mA  
Maximum Operating Current  
Commercial  
560  
30  
Maximum CMOS Standby Current Commercial  
Cypress Semiconductor Corporation  
3901 North First Street  
San Jose, CA 95134  
408-943-2600  
Document #: 38-05161Rev. *E  
Revised April 5, 2004  

CY7C1356A-133AC 替代型号

型号 品牌 替代类型 描述 数据表
CY7C1356C-250AXC CYPRESS

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9-Mbit (256K x 36/512K x 18) Pipelined SRAM w
CY7C1356C-166AXI CYPRESS

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9-Mbit (256K x 36/512K x 18) Pipelined SRAM w
CY7C1356C-166AXC CYPRESS

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9-Mbit (256K x 36/512K x 18) Pipelined SRAM w

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