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CY7C1315KV18-250BZXC PDF预览

CY7C1315KV18-250BZXC

更新时间: 2024-11-16 12:43:55
品牌 Logo 应用领域
赛普拉斯 - CYPRESS 存储内存集成电路静态存储器时钟
页数 文件大小 规格书
33页 1224K
描述
18-Mbit QDR® II SRAM Four-Word Burst Architecture

CY7C1315KV18-250BZXC 技术参数

是否Rohs认证: 符合生命周期:Active
零件包装代码:BGA包装说明:LBGA, BGA165,11X15,40
针数:165Reach Compliance Code:compliant
ECCN代码:3A991.B.2.AHTS代码:8542.32.00.41
Factory Lead Time:1 week风险等级:1.69
Is Samacsys:N最长访问时间:0.45 ns
最大时钟频率 (fCLK):250 MHzI/O 类型:SEPARATE
JESD-30 代码:R-PBGA-B165JESD-609代码:e1
长度:15 mm内存密度:18874368 bit
内存集成电路类型:QDR SRAM内存宽度:36
湿度敏感等级:3功能数量:1
端子数量:165字数:524288 words
字数代码:512000工作模式:SYNCHRONOUS
最高工作温度:70 °C最低工作温度:
组织:512KX36输出特性:3-STATE
封装主体材料:PLASTIC/EPOXY封装代码:LBGA
封装等效代码:BGA165,11X15,40封装形状:RECTANGULAR
封装形式:GRID ARRAY, LOW PROFILE并行/串行:PARALLEL
峰值回流温度(摄氏度):260电源:1.5/1.8,1.8 V
认证状态:Not Qualified座面最大高度:1.4 mm
最大待机电流:0.25 A最小待机电流:1.7 V
子类别:SRAMs最大压摆率:0.59 mA
最大供电电压 (Vsup):1.9 V最小供电电压 (Vsup):1.7 V
标称供电电压 (Vsup):1.8 V表面贴装:YES
技术:CMOS温度等级:COMMERCIAL
端子面层:Tin/Silver/Copper (Sn/Ag/Cu)端子形式:BALL
端子节距:1 mm端子位置:BOTTOM
处于峰值回流温度下的最长时间:30宽度:13 mm
Base Number Matches:1

CY7C1315KV18-250BZXC 数据手册

 浏览型号CY7C1315KV18-250BZXC的Datasheet PDF文件第2页浏览型号CY7C1315KV18-250BZXC的Datasheet PDF文件第3页浏览型号CY7C1315KV18-250BZXC的Datasheet PDF文件第4页浏览型号CY7C1315KV18-250BZXC的Datasheet PDF文件第5页浏览型号CY7C1315KV18-250BZXC的Datasheet PDF文件第6页浏览型号CY7C1315KV18-250BZXC的Datasheet PDF文件第7页 
CY7C1311KV18, CY7C1911KV18  
CY7C1313KV18, CY7C1315KV18  
18-Mbit QDR® II SRAM  
Four-Word Burst Architecture  
18-Mbit QDR® II SRAM Four-Word Burst Architecture  
Features  
Configurations  
Separate independent read and write data ports  
Supports concurrent transactions  
CY7C1311KV18 – 2 M × 8  
CY7C1911KV18 – 2 M × 9  
CY7C1313KV18 – 1 M × 18  
CY7C1315KV18 – 512 K × 36  
333-MHz clock for high bandwidth  
Four-word burst for reducing address bus frequency  
Double data rate (DDR) interfaces on both read and write ports  
(data transferred at 666 MHz) at 333 MHz  
Functional Description  
The CY7C1311KV18, CY7C1911KV18, CY7C1313KV18, and  
CY7C1315KV18 are 1.8 V Synchronous Pipelined SRAMs,  
equipped with QDR II architecture. QDR II architecture consists  
of two separate ports: the read port and the write port to access  
the memory array. The read port has dedicated data outputs to  
support read operations and the write port has dedicated data  
inputs to support write operations. QDR II architecture has  
separate data inputs and data outputs to completely eliminate  
the need to ‘turnaround’ the data bus that exists with common  
I/O devices. Each port can be accessed through a common  
address bus. Addresses for read and write addresses are  
latched on alternate rising edges of the input (K) clock. Accesses  
to the QDR II read and write ports are independent of one  
another. To maximize data throughput, both read and write ports  
are equipped with DDR interfaces. Each address location is  
associated with four 8-bit words (CY7C1311KV18), 9-bit words  
(CY7C1911KV18), 18-bit words (CY7C1313KV18), or 36-bit  
words (CY7C1315KV18) that burst sequentially into or out of the  
device. Because data can be transferred into and out of the  
device on every rising edge of both input clocks (K and K and C  
and C), memory bandwidth is maximized while simplifying  
system design by eliminating bus ‘turnarounds’.  
Two input clocks (K and K) for precise DDR timing  
SRAM uses rising edges only  
Two Input Clocks for Output Data (C and C) to minimize Clock  
skew and flight time mismatches  
Echo clocks (CQ and CQ) simplify data capture in high speed  
systems  
Single multiplexed address input bus latches address inputs  
for read and write ports  
Separate port selects for depth expansion  
Synchronous internally self-timed writes  
QDR® II operates with 1.5 cycle read latency when DOFF is  
asserted HIGH  
OperatessimilartoQDRIdevicewith1cyclereadlatencywhen  
DOFF is asserted LOW  
Available in ×8, ×9, ×18, and ×36 configurations  
Full data coherency, providing most current data  
Depth expansion is accomplished with port selects, which  
enables each port to operate independently.  
Core VDD = 1.8 V (±0.1 V); I/O VDDQ = 1.4 V to VDD  
Supports both 1.5 V and 1.8 V I/O supply  
All synchronous inputs pass through input registers controlled by  
the K or K input clocks. All data outputs pass through output  
registers controlled by the C or C (or K or K in a single clock  
domain) input clocks. Writes are conducted with on-chip  
synchronous self-timed write circuitry.  
Available in 165-ball FBGA package (13 × 15 ×1.4 mm)  
Offered in both Pb-free and non Pb-free packages  
Variable drive HSTL output buffers  
JTAG 1149.1 compatible test access port  
PLL for accurate data placement  
Selection Guide  
Description  
Maximum operating frequency  
Maximum operating current  
333 MHz  
333  
300 MHz  
300  
250 MHz  
250  
200 MHz  
200  
167 MHz  
167  
Unit  
MHz  
mA  
× 8  
× 9  
520  
490  
430  
380  
340  
520  
490  
430  
380  
340  
× 18  
× 36  
530  
500  
440  
390  
350  
730  
670  
590  
500  
450  
Cypress Semiconductor Corporation  
Document Number: 001-58904 Rev. *C  
198 Champion Court  
San Jose, CA 95134-1709  
408-943-2600  
Revised March 1, 2011  
[+] Feedback  

CY7C1315KV18-250BZXC 替代型号

型号 品牌 替代类型 描述 数据表
CY7C1315KV18-250BZCT CYPRESS

完全替代

Standard SRAM, 512KX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-16
CY7C1315KV18-300BZXC CYPRESS

完全替代

18-Mbit QDR® II SRAM Four-Word Burst Archite
CY7C1315KV18-250BZC CYPRESS

完全替代

18-Mbit QDR® II SRAM Four-Word Burst Archite

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