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CY7C1012DV33 PDF预览

CY7C1012DV33

更新时间: 2024-11-24 05:09:31
品牌 Logo 应用领域
赛普拉斯 - CYPRESS /
页数 文件大小 规格书
9页 304K
描述
12-Mbit (512K X 24) Static RAM

CY7C1012DV33 数据手册

 浏览型号CY7C1012DV33的Datasheet PDF文件第2页浏览型号CY7C1012DV33的Datasheet PDF文件第3页浏览型号CY7C1012DV33的Datasheet PDF文件第4页浏览型号CY7C1012DV33的Datasheet PDF文件第5页浏览型号CY7C1012DV33的Datasheet PDF文件第6页浏览型号CY7C1012DV33的Datasheet PDF文件第7页 
CY7C1012DV33  
PRELIMINARY  
12-Mbit (512K X 24) Static RAM  
power-down feature that significantly reduces power  
consumption when deselected.  
Features  
• High speed  
Writing the data bytes into the SRAM is accomplished when  
the chip select controlling that byte is LOW and the write  
enable input (WE) input is LOW. Data on the respective  
input/output (I/O) pins is then written into the location specified  
on the address pins (A0–A18). Asserting all of the chip selects  
LOW and write enable LOW will write all 24 bits of data into  
the SRAM. Output enable (OE) is ignored while in WRITE  
mode.  
— tAA = 8 ns  
• Low active power  
— ICC = 185 mA @ 8 ns  
• Low CMOS standby power  
— ISB2 = 25 mA  
• Operating voltages of 3.3 ± 0.3V  
• 2.0V data retention  
Data bytes can also be individually read from the device.  
Reading a byte is accomplished when the chip select  
controlling that byte is LOW and write enable (WE) HIGH while  
output enable (OE) remains LOW. Under these conditions, the  
contents of the memory location specified on the address pins  
will appear on the specified data input/output (I/O) pins.  
Asserting all the chip selects LOW will read all 24 bits of data  
from the SRAM.  
• Automatic power-down when deselected  
• TTL-compatible inputs and outputs  
• Available in Lead Pb-Free Standard 119-ball PBGA  
Functional Description  
The 24 I/O pins (I/O0–I/O23) are placed in a high-impedance  
state when all the chip selects are HIGH or when the output  
enable (OE) is HIGH during a READ mode. For further details,  
refer to the truth table of this data sheet.  
The CY7C1012DV33 is a high-performance CMOS static  
RAM organized as 512K words by 24 bits. Each data byte is  
separately controlled by the individual chip selects (CE1, CE2,  
CE3). CE1 controls the data on the I/O0–I/O7, while CE2  
controls the data on I/O8–I/O15, and CE3 controls the data on  
the data pins I/O16–I/O23. This device has an automatic  
Functional Block Diagram  
INPUT BUFFER  
A
0
A
1
A
2
I/O0–I/O7  
A
3
512K x 24  
ARRAY  
A
4
I/O8–I/O15  
I/O16–I/O23  
A
5
A
6
A
7
A
8
A
9
CE1, CE2, CE3  
COLUMN  
DECODER  
WE  
CONTROL LOGIC  
OE  
Selection Guide  
–8  
8
Unit  
ns  
Maximum Access Time  
Maximum Operating Current  
185  
25  
mA  
mA  
Maximum CMOS Standby Current  
Cypress Semiconductor Corporation  
Document #: 38-05610 Rev. *B  
198 Champion Court  
San Jose, CA 95134-1709  
408-943-2600  
Revised September 4, 2006  
[+] Feedback  

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