®
CY62147V MoBL
4M (256K x 16) Static RAM
deselected (CE HIGH) or when CE is LOW and both BLE and
BHE are HIGH. The input/output pins (I/O0 through I/O15) are
placed in a high-impedance state when: deselected (CE
HIGH), outputs are disabled (OE HIGH), BHE and BLE are
disabled (BHE, BLE HIGH), or during a write operation (CE
LOW, and WE LOW).
Features
• Wide voltage range: 2.7V–3.6V
• Ultra-low active, standby power
• Easy memory expansion with CE and OE features
• TTL-compatible inputs and outputs
• Automatic power-down when deselected
• CMOS for optimum speed/power
Writing to the device is accomplished by taking Chip Enable
(CE) and Write Enable (WE) inputs LOW. If Byte Low Enable
(BLE) is LOW, then data from I/O pins (I/O0 through I/O7), is
written into the location specified on the address pins (A0
through A17). If Byte High Enable (BHE) is LOW, then data
from I/O pins (I/O8 through I/O15) is written into the location
specified on the address pins (A0 through A17).
• Package available in a standard 44-pin TSOP Type II
(forward pinout) package
Functional Description[1]
The CY62147V is a high-performance CMOS static RAM
organized as 256K words by 16 bits. These devices feature
advanced circuit design to provide ultra-low active current.
This is ideal for providing More Battery Life (MoBL®) in
portable applications such as cellular telephones. The devices
also have an automatic power-down feature that significantly
reduces power consumption by 99% when addresses are not
toggling. The device can also be put into standby mode when
Reading from the device is accomplished by taking Chip
Enable (CE) and Output Enable (OE) LOW while forcing the
Write Enable (WE) HIGH. If Byte Low Enable (BLE) is LOW,
then data from the memory location specified by the address
pins will appear on I/O0 to I/O7. If Byte High Enable (BHE) is
LOW, then data from memory will appear on I/O8 to I/O15. See
the truth table at the back of this data sheet for a complete
description of read and write modes.
Logic Block Diagram
DATA IN DRIVERS
A
10
9
A
A
8
7
6
A
A
A
A
A
256K x 16
5
4
RAM Array
I/O – I/O
0
7
2048 x 2048
3
I/O – I/O
A
8
15
2
A
A
1
0
COLUMN DECODER
BHE
WE
CE
OE
BLE
CE
Power-down
Circuit
BHE
BLE
Note:
1. For best practice recommendations, please refer to the Cypress application note “System Design Guidelines” on http://www.cypress.com.
Cypress Semiconductor Corporation
•
3901 North First Street
•
San Jose
•
CA 95134
•
408-943-2600
Document #: 38-05050 Rev. *A
Revised August 28, 2002