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CY62146CV30LL-55BAI PDF预览

CY62146CV30LL-55BAI

更新时间： 2024-11-22 21:55:11
品牌 Logo 应用领域
赛普拉斯 - CYPRESS 存储内存集成电路静态存储器
页数 文件大小 规格书
12页 357K
描述
256K x 16 Static RAM

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中文翻译

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CY62146CV30LL-55BAI 技术参数

是否Rohs认证： 不符合生命周期：Obsolete
零件包装代码：BGA包装说明：7 X 8.50 MM, 1.20 MM HEIGHT, FINE PITCH, TBGA-48
针数：48Reach Compliance Code：not_compliant
ECCN代码：3A991.B.2.AHTS代码：8542.32.00.41
Factory Lead Time：1 week风险等级：5.75
最长访问时间：55 nsI/O 类型：COMMON
JESD-30 代码：S-PBGA-B48JESD-609代码：e0
长度：8.5 mm内存密度：4194304 bit
内存集成电路类型：STANDARD SRAM内存宽度：16
功能数量：1端子数量：48
字数：262144 words字数代码：256000
工作模式：ASYNCHRONOUS最高工作温度：85 °C
最低工作温度：-40 °C组织：256KX16
输出特性：3-STATE封装主体材料：PLASTIC/EPOXY
封装代码：TFBGA封装等效代码：BGA48,6X8,30
封装形状：SQUARE封装形式：GRID ARRAY, THIN PROFILE, FINE PITCH
并行/串行：PARALLEL电源：3 V
认证状态：Not Qualified座面最大高度：1.2 mm
最大待机电流：0.00001 A最小待机电流：1.5 V
子类别：SRAMs最大压摆率：0.025 mA
最大供电电压 (Vsup)：3.3 V最小供电电压 (Vsup)：2.7 V
标称供电电压 (Vsup)：3 V表面贴装：YES
技术：CMOS温度等级：INDUSTRIAL
端子面层：Tin/Lead (Sn/Pb)端子形式：BALL
端子节距：0.75 mm端子位置：BOTTOM
宽度：7 mmBase Number Matches：1

CY62146CV30LL-55BAI 数据手册

 浏览型号CY62146CV30LL-55BAI的Datasheet PDF文件第2页浏览型号CY62146CV30LL-55BAI的Datasheet PDF文件第3页浏览型号CY62146CV30LL-55BAI的Datasheet PDF文件第4页浏览型号CY62146CV30LL-55BAI的Datasheet PDF文件第5页浏览型号CY62146CV30LL-55BAI的Datasheet PDF文件第6页浏览型号CY62146CV30LL-55BAI的Datasheet PDF文件第7页 
CY62146CV30 MoBL™  
256K x 16 Static RAM  
reduces power consumption by 80% when addresses are not  
toggling. The device can also be put into standby mode  
reducing power consumption by 99% when deselected (CE  
HIGH). The input/output pins (I/O0 – I/O15) are placed in a  
high-impedance state when: deselected (CE HIGH), outputs  
are disabled (OE HIGH), both Byte High Enable and Byte Low  
Enable are disabled (BHE, BLE HIGH), or during a Write  
operation (CE LOW and WE LOW).  
Features  
• High speed:  
— 55 ns and 70 ns availability  
• Voltage range:  
— CY62146CV30: 2.7V – 3.3V  
• Pin compatible with CY62146V  
• Ultra-low active power  
Writing to the device is accomplished by taking Chip Enable  
(CE) and Write Enable (WE) inputs LOW. If Byte Low Enable  
(BLE) is LOW, then data from I/O pins (I/O0 – I/O7), is written  
into the location specified on the address pins (A0 – A17). If  
Byte High Enable (BHE) is LOW, then data from I/O pins  
(I/O8 – I/O15) is written into the location specified on the  
address pins (A0 – A17).  
— Typical active current: 1.5 mA @ f = 1 MHz  
— Typical active current: 7 mA @ f = fmax (70 ns speed)  
• Low standby power  
• Easy memory expansion with CE and OE features  
• Automatic power-down when deselected  
• CMOS for optimum speed/power  
Reading from the device is accomplished by taking Chip  
Enable (CE) and Output Enable (OE) LOW while forcing the  
Write Enable (WE) HIGH. If Byte Low Enable (BLE) is LOW,  
then data from the memory location specified by the address  
pins will appear on I/O0 – I/O7. If Byte High Enable (BHE) is  
LOW, then data from memory will appear on I/O8 to I/O15. See  
the Truth Table on page 9 for a complete description of Read  
and Write modes.  
Functional Description  
The CY62146CV30 is a high-performance CMOS static RAM  
organized as 256K words by 16 bits. This device features  
advanced circuit design to provide ultra-low active current.  
This is ideal for providing More Battery Life™ (MoBL™) in  
portable applications such as cellular telephones. The device  
also has an automatic power-down feature that significantly  
The CY62146CV30 is available in 48-ball FBGA packaging.  
Logic Block Diagram  
DATA IN DRIVERS  
A
10  
9
A
A
A
A
A
A
A
8
7
6
256K × 16  
5
4
RAM Array  
I/O – I/O  
0
7
2048 × 2048  
3
2
I/O – I/O  
A
8
15  
A
A
1
0
COLUMN DECODER  
BHE  
WE  
CE  
OE  
BLE  
Cypress Semiconductor Corporation  
•
3901 North First Street  
•
San Jose  
•
CA 95134  
•
408-943-2600  
Document #: 38-05203 Rev. **  
Revised December 17, 2001  
1234567...12

中文翻译

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