Product Brief
CX6100
Structured ASIC with PCI Express
Product Description
The CX6100 product family combines a built-in, silicon-proven, industry standard PHY for PCI
Express with the well-proven X-Cell™ architecture, to provide industry leading performance
using the UMC standard eight-metal 0.13-µm deep submicron process. Only two to four metal
layers are used for customization, allowing prototypes to be manufactured, assembled, tested,
and shipped in just 4 to 5 weeks.
The built-in, silicon-proven PCI Express PHY, in combination with the ChipX synthesizable
processors and PCI Express endpoint, root port, or bridge controllers, form a complete PCI
Express subsystem capable of achieving PCI-SIG compliance. You can also use your own PCI
Express controller where desired. The PCI Express subsystem on the CX6100 family of products
removes complexity and the risk of IP selection and IP interoperability testing.
The CX6100 product family builds on four generations of ChipX Structured ASIC products (see
Table 1). The core technology combines our accumulated design expertise with a focus on
Networking and Industrial PCI Express interface needs. The CX6100 PCI Express Structured
ASIC platform delivers an ideal solution that is high performance and appropriate for low to
high-volume production.
Table 1 CX6100 SerDes/PCI Express Structured ASIC Platforms
Memory
(Kbits)
(9-Kb
Usable
Gates
(KGates)
Cache
Memory
Blocks
Maximum
Configurable
I/O2
Part
PCI
Lanes
PLL
Packages
Number1
Banks)
CX6140
CX6142
CX6143
637
743
850
1250
(138)
2 x 16 KB
2 x 16 KB
2 x 16 KB
7
240
248
252
4
4
4
256 LBGA,
388 PBGA,
456 PBGA
1125
(125)
7
7
256 LBGA,
388 PBGA,
456 PBGA
1000
(111)
256 LBGA,
388 PBGA,
456 PBGA
1. ChipX will consider a private product for your company.
2. Configurable I/O excludes PCI Express PHY pins and Power/Gnd connections
Applications
The CX6100 is optimized with IP content and size ranges to support specific system
applications.
June 4, 2007
0289-6k-070-A
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