CRJT065N60G3F-G
The name and content of poisonous and harmful materialin products
Hazardous Substance
Pb
Hg
Cd
≤
Cr(VI)
PBB
PBDE
DIBP
DEHP
DBP
BBP
Limit
≤0.1% ≤0.1%
≤0.1% ≤0.1% ≤0.1% ≤0.1% ≤0.1% ≤0.1% ≤0.1%
0.01%
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×
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Lead Frame
Molding
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Chip
Wire Bonding
Solder
○:Means thehazardousmaterialis underthe criterionof 2011/65/EU.
×:Meansthehazardousmaterialexceeds thecriterionof 2011/65/EU.
Note
The plumbum element of solder exist in products presently, but within the allowed range
of Eurogroup’s RoHS.
Warnings
1. Exceeding the maximum ratings of the device in performance may cause damage to the device,
even the permanent failure, which may affect the dependability of the machine. It is suggested
to be used under 80 percentof the maximum ratings of the device.
2. When installing the heat sink, please pay attention to the torsional moment and the smoothness
of the heatsink.
3. VDMOSFET is the device which is sensitive to the static electricity, it is necessary to protect
the devicefrombeingdamaged bythe static electricitywhenusing it.
4. This publication is made by Huajing Microelectronics and subject to regular change without
notice.
WUXI CHINA RESOURCES HUAJING MICROELECTRONICS CO., LTD.
Add: No.14LiangxiRD. Wuxi, Jiangsu, China Mail:214061
H
https://www.crmicro.com
Tel: +86 0510-85807228 Fax: +86- 0510-85800864
MarketingPart:
Post:214061
Tel: +86 0510-81805277/81805336
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W UXI C HIN A R ES O UR C ES HUAJ ING MICRO EL EC TRON ICS CO., LTD.
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