Datasheet > CPC1908_10

CPC1908_10

更新时间： 2024-11-21 07:08:55

品牌	Logo	应用领域
CLARE		继电器功率继电器
页数	文件大小	规格书
7页	881K
描述
i4-PAC? Power Relay

阅读下载

中文翻译

获取价格

数据手册

如果您发现信息不准确，欢迎纠错

CPC1908_10 数据手册

CPC1908

Single-Pole, Normally Open

i4-PAC™ Power Relay

Characteristics

Description

Clare and IXYS have combined to bring OptoMOS

technology, reliability and compact size to a new family

of high-power Solid State Relays.

Parameter

Rating

Units

V_P

Blocking Voltage

Load Current, T_A=25°C:

With 5°C/W Heat Sink

No Heat Sink

8.5

3.5

As part of this family, the CPC1908 single-pole

rms

normally open (1-Form-A) Solid State Power Relay is

rated for up to 8.5A

continuous load current with a

On-Resistance

0.3

rms

5°C/W heat sink.

0.35

°C/W

θJC

The CPC1908 employs optically coupled MOSFET

technology to provide 2500V of input to output

Features

rms

• 8.5A

Load Current with 5°C/W Heat Sink

isolation. The output, constructed with efficient

MOSFET switches and photovoltaic die, uses Clare’s

patented OptoMOS architecture while the input, a

highly efficient GaAlAs infrared LED, provides the

optically coupled control. The combination of low

on-resistance and high load current handling

capability makes this relay suitable for a variety of high

performance switching applications.

rms

• Low 0.3Ω On-Resistance

• 60V Blocking Voltage

• 2500V

Input/Output Isolation

rms

• Low Thermal Resistance (0.35 °C/W)

• Electrically Non-conductive Thermal Pad for Heat

Sink Applications

• Low Drive Power Requirements

• Arc-Free With No Snubbing Circuits

• No EMI/RFI Generation

The unique i4-PAC package pioneered by IXYS

enables Solid State Relays to achieve the highest load

current and power ratings. This package features a

unique IXYS process where the silicon chips are soft

soldered onto the Direct Copper Bond (DCB)

• Machine Insertable, Wave Solderable

Applications

• Industrial Controls / Motor Control

• Robotics

• Medical Equipment—Patient/Equipment Isolation

• Instrumentation

• Multiplexers

substrate instead of the traditional copper leadframe.

The DCB ceramic, the same substrate used in high

power modules, not only provides 2500V

isolation,

rms

but also very low thermal resistance (0.35 °C/W).

• Data Acquisition

Ordering Information

• Electronic Switching

• I/O Subsystems

• Meters (Watt-Hour, Water, Gas)

• Transportation Equipment

• Aerospace/Defense

Part

Description

CPC1908J

i4-PAC Package (25 per tube)

Approvals

Switching Characteristics

• UL 508 Certified Component: File E69938

Form-A

Pin Configuration

I_F

90%

10%

I_LOAD

off

RoHS

2002/95/EC

DS-CPC1908 - R07

www.clare.com

12 3 4 5 6 7

中文翻译

下载PDF

与CPC1908_10相关器件

型号	品牌	获取价格	描述	数据表
CPC1908J	CLARE	获取价格	i4-PAC⑩ Power Relay
CPC1908J	LITTELFUSE	获取价格	基于光隔离MOSFET的固态功率继电器采用i4-PAC和ISOPLUS-264封装，具有直
CPC1909	CLARE	获取价格	ISOPLUS⑩-264 Power Relay
CPC1909_10	CLARE	获取价格	ISOPLUS?-264 Power Relay
CPC1909J	CLARE	获取价格	ISOPLUS⑩-264 Power Relay
CPC1909J	LITTELFUSE	获取价格	基于光隔离MOSFET的固态功率继电器采用i4-PAC和ISOPLUS-264封装，具有直
CPC1916	CLARE	获取价格	Power SIP Relay
CPC1916_10	CLARE	获取价格	OptoMOS? Power SIP Relay
CPC1916Y	CLARE	获取价格	Power SIP Relay
CPC1916Y	LITTELFUSE	获取价格	光隔离固态功率继电器（基于MOSFET）。功率SIP封装: 引脚到引脚兼容其他固态继电器

与CPC1908_10相关文章

解析光耦仿真器：升级光耦合器技术的必要性
2024-11-18

31
英伟达新一代Blackwell GPU过热问题致交付延迟
2024-11-18

22
国产厂商思特威CMOS图像传感器芯片单月出货超1亿颗，技术创新引领行业发展
2024-11-14

51
台积电5nm和3nm产能利用率达100%，半导体行业景气度持续攀升
2024-11-14

50

产品中心

服务支持

精选活动

关于我们

帮助中心

CPC1908_10

CPC1908_10 数据手册

与CPC1908_10相关器件

与CPC1908_10相关文章

您还可以找

产品中心

服务支持

精选活动

关于我们

帮助中心

CPC1908_10

CPC1908_10 数据手册

与CPC1908_10相关器件

与CPC1908_10相关文章

您还可以找

您在本页遇到什么问题？