Power Solid State Relays
i4-PAC™, ISOPLUS264, and the Power SIP Relays
Features
• Solid State Reliability
• Handle loads up to 15Arms
• Voltage ratings from 60V - 1000V
• Low On Resistance
• Compact i4-PAC™ Package with low
thermal resistance and heat sink
• Industry Standard 4-Pin SIP
Package
• Low input control current (≤ 10mA)
• UL 508 Approval Pending
Applications
• Motor controls
• Power Supplies
• Robotics
• Medical equipment
• Transportation equipment
• Consumer appliances
• Industrial control
• Test and Measurement Equipment
• Aerospace/Defense
Description
This unique family of 1-Form-A high power Solid State Relays (SSRs) combines Clare’s proven
optical isolation with IXYS advanced power MOSFET devices to deliver the industry’s highest
power MOSFET based SSRs. The efficient MOSFET switches and photovoltaic die employ Clare’s
patented OptoMOS™ architecture which is based on an optically-coupled input controlled by a
highly efficient GaAlAs infrared LED. The combination of low on resistance and high load current
handling capabilities makes these relays suitable for a variety of high performance switching
applications. As with all Clare SSRs, they are ideal EMR replacements and offer higher reliability,
lower drive current, no contact bounce and peak performance in the harshest shock, vibration
and magnetic environments.
With the recent expansion of the power relay family, Clare provides maximum flexibility for
designers as it now offers a full range of current (up to 15Arms) and voltage (60V to 1000V)
options, full AC/DC or reduced cost DC-only operation in 3 different package types (Power SIP,
i4-PAC™ and the ISOPLUS264).
The SIP package offers pin for pin compatibility with other power solid state relays, allowing
designers to bring Clare’s superior reliability to existing designs without changing printed circuit
boards. What distinguishes Clare’s offerings from other power solid state relays are the unique
package options, the i4-PAC™ and the ISOPLUS264. Both are part of the IXYS family of ISOPLUS
packages. These packages feature the IXYS unique (patent pending) process where the silicon
chips are soft soldered onto the Direct Copper Bond (DCB) substrate instead of the usual copper
lead frame. The DCB ceramic, the same substrate material used in high power modules, not only
provides isolation capability (2500Vrms) but also unbeatable low thermal resistance (0.30 ºC/W for
the ISOPLUS264) compared to conventional external mounted isolation material. Along with the
ability to attach a heat sink, these factors combine to give Clare’s new power relays unbeatable
current handling capability in a compact package.
Block Diagrams:
* i4-PAC™ and ISOPLUS264 have
both AC/DC and DC-only versions
AC/DC Version*
DC Version*