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CMC01_06

更新时间： 2024-01-25 16:30:48
品牌 Logo 应用领域
东芝 - TOSHIBA /
页数 文件大小 规格书
5页 195K
描述
SILICON DIFFUSED TYPE For Strobe Discharge Circuit

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中文翻译

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CMC01_06 数据手册

 浏览型号CMC01_06的Datasheet PDF文件第2页浏览型号CMC01_06的Datasheet PDF文件第3页浏览型号CMC01_06的Datasheet PDF文件第4页浏览型号CMC01_06的Datasheet PDF文件第5页 
CMC01  
TOSHIBA RECTIFIER SILICON DIFFUSED TYPE  
CMC01  
For Strobe Discharge Circuit  
Unit: mm  
•
•
•
•
Repetitive peak reverse voltage  
: VRRM = 400 V  
Average forward current: IF (AV) = 1.0 A  
Repetitive peak forward current: IFRM = 150 A (Refer to the Note 2)  
Small surface-mount package  
“M−FLATTM” (Toshiba package name)  
Absolute Maximum Ratings (Ta = 25°C)  
Symbol  
Rating  
Unit  
Characteristics  
Repetitive peak reverse voltage  
Average forward current (Note 1)  
V
400  
V
A
RRM  
I
1.0(Ta=47°C)  
F (AV)  
Peak one cycle surge forward current  
(non-repetitive)  
I
30 (50 Hz)  
150  
A
A
FSM  
Repetitive peak forward current  
(Note 2)  
I
FRM  
Junction temperature  
T
-40～150  
-40～150  
°C  
°C  
j
JEDEC  
JEITA  
―
―
Storage temperature range  
T
stg  
Note 1: Device mounted on a glass-epoxy board  
board size: 50 mm × 50 mm  
TOSHIBA  
3-4E1A  
soldering land: 6 mm ×6 mm  
glass-epoxy board thickness 1.6t  
Weight: 0.023 g (typ.)  
Note 3: Using continuously under heavy loads (e.g. the application of  
high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to  
decrease in the reliability significantly even if the operating conditions (i.e. operating  
temperature/current/voltage, etc.) are within the absolute maximum ratings.  
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook  
(“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.e. reliability test  
report and estimated failure rate, etc).  
Electrical Characteristics (Ta = 25°C)  
Characteristics  
Symbol  
Test Condition  
Min  
Typ.  
Max  
Unit  
Peak forward voltage  
Repetitive peak reverse current  
V
I
= 1.0 A （Pulse test）  
FM  
⎯
⎯
0.86  
1.0  
10  
V
FM  
I
V
= 400 V （Pulse test）  
⎯
μA  
RRM  
RRM  
Device mounted on a ceramic board  
Board size:  
50 mm × 50 mm  
⎯
⎯
⎯
⎯
60  
Soldering land: 2 mm × 2 mm  
Ceramic board thickness: 0.64t  
Device mounted on a glass-epoxy  
board  
Board size: 50 mm × 50 mm  
Soldering land: 6 mm × 6 mm  
glass-epoxy board thickness: 1.6t  
110  
R
°C/W  
th (j-a)  
Thermal resistance  
Device mounted on a glass-epoxy  
board  
Board size: 50 mm × 50 mm  
Soldering land: 2.1 mm × 1.4 mm  
glass-epoxy board thickness: 1.6t  
⎯
⎯
⎯
⎯
180  
16  
R
th (j-ℓ)  
―
°C/W  
1
2006-11-06  
12345

中文翻译

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