是否Rohs认证: | 不符合 | 生命周期: | Obsolete |
零件包装代码: | DIP | 包装说明: | DIP, DIP18,.3 |
针数: | 18 | Reach Compliance Code: | unknown |
HTS代码: | 8542.39.00.01 | 风险等级: | 5.92 |
Is Samacsys: | N | JESD-30 代码: | R-PDIP-T18 |
JESD-609代码: | e0 | 长度: | 21.97 mm |
功能数量: | 1 | 端子数量: | 18 |
最高工作温度: | 70 °C | 最低工作温度: | |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | DIP |
封装等效代码: | DIP18,.3 | 封装形状: | RECTANGULAR |
封装形式: | IN-LINE | 峰值回流温度(摄氏度): | NOT SPECIFIED |
电源: | 5 V | 认证状态: | Not Qualified |
座面最大高度: | 4.57 mm | 子类别: | Telecom Signaling Circuits |
最大压摆率: | 7 mA | 标称供电电压: | 5 V |
表面贴装: | NO | 技术: | CMOS |
电信集成电路类型: | DTMF SIGNALING CIRCUIT | 温度等级: | COMMERCIAL |
端子面层: | Tin/Lead (Sn/Pb) | 端子形式: | THROUGH-HOLE |
端子节距: | 2.54 mm | 端子位置: | DUAL |
处于峰值回流温度下的最长时间: | NOT SPECIFIED | 宽度: | 7.62 mm |
Base Number Matches: | 1 |
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