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CFY30 PDF预览

CFY30

更新时间: 2024-02-07 17:32:20
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体小信号场效应晶体管射频小信号场效应晶体管光电二极管放大器
页数 文件大小 规格书
6页 50K
描述
GaAs FET (Low noise Fmin = 1.4 dB @ 4 GHz High gain 11.5 dB typ. @ 4 GHz)

CFY30 技术参数

是否Rohs认证: 不符合生命周期:Transferred
包装说明:SMALL OUTLINE, R-PDSO-G4Reach Compliance Code:unknown
ECCN代码:EAR99HTS代码:8541.21.00.75
风险等级:5.34Is Samacsys:N
其他特性:LOW NOISE外壳连接:SOURCE
配置:SINGLE最小漏源击穿电压:5 V
最大漏极电流 (Abs) (ID):0.08 A最大漏极电流 (ID):0.08 A
FET 技术:JUNCTION最高频带:C BAND
JESD-30 代码:R-PDSO-G4JESD-609代码:e0
元件数量:1端子数量:4
工作模式:DEPLETION MODE最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE极性/信道类型:N-CHANNEL
功耗环境最大值:0.25 W最小功率增益 (Gp):10 dB
认证状态:Not Qualified子类别:FET RF Small Signal
表面贴装:YES端子面层:Tin/Lead (Sn/Pb)
端子形式:GULL WING端子位置:DUAL
晶体管应用:AMPLIFIER晶体管元件材料:GALLIUM ARSENIDE
Base Number Matches:1

CFY30 数据手册

 浏览型号CFY30的Datasheet PDF文件第2页浏览型号CFY30的Datasheet PDF文件第3页浏览型号CFY30的Datasheet PDF文件第4页浏览型号CFY30的Datasheet PDF文件第5页浏览型号CFY30的Datasheet PDF文件第6页 
GaAs FET  
CFY 30  
________________________________________________________________________________________________________  
D a t a s h e e t  
* Low noise ( Fmin = 1.4 dB @ 4 GHz )  
* High gain ( 11.5 dB typ. @ 4 GHz )  
* For oscillators up to 12 GHz  
* For amplifiers up to 6 GHz  
* Ion implanted planar structure  
* Chip all gold metallization  
* Chip nitride passivation  
ESD: Electrostatic discharge sensitive device,  
observe handling precautions!  
Type  
Marking  
Ordering code  
(tape and reel)  
Pin Configuration  
Package 1)  
1
2
3
4
CFY 30  
A2  
Q62703-F97 S D S G  
SOT-143  
Maximum ratings  
Symbol  
Value  
Unit  
V
Drain-source voltage  
Drain-gate voltage  
V
5
7
DS  
DG  
GS  
V
V
V
Gate-source voltage  
Drain current  
-4 ... +0.5  
80  
V
I
mA  
°C  
°C  
mW  
D
Channel temperature  
Storage temperature range  
Total power dissipation (TS < 70°C)  
T
T
150  
Ch  
-40...+150  
250  
stg  
2)  
P
tot  
Thermal resistance  
2)  
R
<320  
K/W  
Channel-soldering point  
thChS  
1) Dimensions see chapter Package Outlines  
2) TS is measured on the source 1 lead at the soldering point to the PCB.  
Siemens Aktiengesellschaft  
pg. 1/6  
11.01.1996  
HL EH PD 21  

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