Features
■ Lead free device (RoHS compliant*)
■ Glass passivated chip
■ Low reverse leakage current
■ Low forward voltage drop
■ High current capability
CD214C-R350~R31000 Glass Passivated Rectifiers
General Information
The markets of portable communications, computing and video equipment are challenging the semiconductor industry to develop
increasingly smaller electronic components. Bourns offers Glass Passivated Rectifiers for rectification applications, in compact chip
DO-214AB (SMC) size format, which offer PCB real estate savings and are considerably smaller than competitive parts. The Glass Passivated
Rectifier Diodes offer a forward current of 3.0 A with a choice of repetitive peak reverse voltage of 50 V up to 1000 V.
Bourns Chip Diodes conform to JEDEC standards, are easy to handle on standard pick and place equipment and their flat configuration
minimizes roll away.
Electrical Characteristics (@ T = 25 °C Unless Otherwise Noted)
A
CD214C-
R3400
Parameter
Symbol
Unit
R350
R3100
R3200
R3600
R3800
R31000
Maximum Repetitive
Peak Reverse Voltage
V
V
50
100
200
400
600
800
1000
V
RRM
Maximum RMS Voltage
35
50
70
140
200
280
400
420
600
560
800
700
V
V
RMS
Maximum DC Blocking Voltage
Maximum Average Forward
V
100
1000
DC
I
3.0
A
Rectified Current (@ T = 100 °C)1
L
(AV)
DC Reverse Current @ Rated DC
I
10.0
µA
R
R
Blocking Voltage (@T = 25 °C)
J
DC Reverse Current @ Rated DC
I
250.0
40
µA
pF
Blocking Voltage (@T = 125 °C)
J
Typical Junction Capacitance2
C
J
Maximum Instantaneous
Forward Voltage @ 3 A
Typical Thermal Resistance3
V
1.15
10
V
F
R
θJA
°C/W
Peak forward surge current 8.3 ms
single half sine-wave superimposed
on rated load (JEDEC Method)
I
100
A
FSM
Notes:
1 See Forward Derating Curve.
2 Measured at 1 MHz and an applied reverse voltage of 4.0 V.
3 Thermal resistance from junction to lead.
Thermal Characteristics (@ T = 25 °C Unless Otherwise Noted)
A
Parameter
Symbol
CD214C-R350~R31000
Unit
Operating Temperature Range
Storage Temperature Range
TJ
-65 to +175
-65 to +175
°C
°C
TSTG
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex.
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.