是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Obsolete | 零件包装代码: | QFN |
包装说明: | QFN-36 | 针数: | 36 |
Reach Compliance Code: | compliant | HTS代码: | 8542.39.00.01 |
风险等级: | 5.84 | Is Samacsys: | N |
JESD-30 代码: | S-XQCC-N36 | JESD-609代码: | e4 |
长度: | 6 mm | 湿度敏感等级: | 3 |
端子数量: | 36 | 封装主体材料: | UNSPECIFIED |
封装代码: | HVQCCN | 封装形状: | SQUARE |
封装形式: | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | 峰值回流温度(摄氏度): | 260 |
认证状态: | Not Qualified | 座面最大高度: | 0.9 mm |
表面贴装: | YES | 技术: | CMOS |
温度等级: | OTHER | 端子面层: | Nickel/Palladium/Gold (Ni/Pd/Au) |
端子形式: | NO LEAD | 端子节距: | 0.5 mm |
端子位置: | QUAD | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
宽度: | 6 mm | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
CC1111F32RSP | TAOS |
获取价格 |
Low-power sub-1 GHz RF System-on-Chip (SoC) with MCU, memory, transceiver, and USB control | |
CC1111F32RSP | TI |
获取价格 |
Low-Power SoC (System-on-Chip) with MCU, Memory, Sub-1 GHz RF Transceiver, and USB Control | |
CC1111F32RSPG3 | TI |
获取价格 |
Sub-1GHz System-on-Chip with MCU, 32kB Flash memory and USB 2.0 36-VQFN 0 to 85 | |
CC1111F32RSPR | TI |
获取价格 |
Low-Power SoC (System-on-Chip) with MCU, Memory, Sub-1 GHz RF Transceiver, and USB Control | |
CC1111F32RSPR | TAOS |
获取价格 |
Low-power sub-1 GHz RF System-on-Chip (SoC) with MCU, memory, transceiver, and USB control | |
CC1111F32RSPRG3 | TI |
获取价格 |
TELECOM, CELLULAR, RF AND BASEBAND CIRCUIT | |
CC1111F8RSP | TAOS |
获取价格 |
Low-power sub-1 GHz RF System-on-Chip (SoC) with MCU, memory, transceiver, and USB control | |
CC1111F8RSP | TI |
获取价格 |
Low-Power SoC (System-on-Chip) with MCU, Memory, Sub-1 GHz RF Transceiver, and USB Control | |
CC1111F8RSPG3 | TI |
获取价格 |
TELECOM, CELLULAR, RF AND BASEBAND CIRCUIT | |
CC1111F8RSPR | TI |
获取价格 |
Low-Power SoC (System-on-Chip) with MCU, Memory, Sub-1 GHz RF Transceiver, and USB Control |