是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Obsolete | 零件包装代码: | QFN |
包装说明: | HVQCCN, | 针数: | 36 |
Reach Compliance Code: | compliant | HTS代码: | 8542.39.00.01 |
风险等级: | 5.82 | JESD-30 代码: | S-XQCC-N36 |
JESD-609代码: | e4 | 长度: | 6 mm |
湿度敏感等级: | 3 | 端子数量: | 36 |
封装主体材料: | UNSPECIFIED | 封装代码: | HVQCCN |
封装形状: | SQUARE | 封装形式: | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度): | 260 | 认证状态: | Not Qualified |
座面最大高度: | 0.9 mm | 表面贴装: | YES |
技术: | CMOS | 温度等级: | OTHER |
端子面层: | Nickel/Palladium/Gold (Ni/Pd/Au) | 端子形式: | NO LEAD |
端子节距: | 0.5 mm | 端子位置: | QUAD |
处于峰值回流温度下的最长时间: | NOT SPECIFIED | 宽度: | 6 mm |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
CC1111F8RSPG3 | TI |
获取价格 |
TELECOM, CELLULAR, RF AND BASEBAND CIRCUIT |
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CC1111F8RSPR | TI |
获取价格 |
Low-Power SoC (System-on-Chip) with MCU, Memory, Sub-1 GHz RF Transceiver, and USB Control |
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CC1111F8RSPR | TAOS |
获取价格 |
Low-power sub-1 GHz RF System-on-Chip (SoC) with MCU, memory, transceiver, and USB control |
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CC1111F8RSPRG3 | TI |
获取价格 |
TELECOM, CELLULAR, RF AND BASEBAND CIRCUIT |
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CC1111FX | TI |
获取价格 |
Low-Power SoC (System-on-Chip) with MCU, Memory, Sub-1 GHz RF Transceiver, and USB Control |
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CC1-111-GAW | RCD |
获取价格 |
Fixed Resistor, Carbon Composition, 1W, 110ohm, 500V, 2% +/-Tol, 1500ppm/Cel, Through Hole |
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CC1-111-GTW | RCD |
获取价格 |
Fixed Resistor, Carbon Composition, 1W, 110ohm, 500V, 2% +/-Tol, 1500ppm/Cel, Through Hole |
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CC1-111-JAW | RCD |
获取价格 |
Fixed Resistor, Carbon Composition, 1W, 110ohm, 500V, 5% +/-Tol, 1500ppm/Cel, Through Hole |
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CC1-111-JBW | RCD |
获取价格 |
Fixed Resistor, Carbon Composition, 1W, 110ohm, 500V, 5% +/-Tol, 1500ppm/Cel, Through Hole |
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CC1-111-JTW | RCD |
获取价格 |
Fixed Resistor, Carbon Composition, 1W, 110ohm, 500V, 5% +/-Tol, 1500ppm/Cel, Through Hole |
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