生命周期: | Active | 包装说明: | Axial, |
Reach Compliance Code: | compliant | ECCN代码: | EAR99 |
HTS代码: | 8533.10.00.60 | 风险等级: | 5.19 |
引线直径: | 0.9 mm | 安装特点: | THROUGH HOLE MOUNT |
端子数量: | 2 | 最高工作温度: | 130 °C |
最低工作温度: | -55 °C | 封装直径: | 5.9 mm |
封装长度: | 15.5 mm | 封装形式: | Axial |
包装方法: | AMMO PACK | 额定功率耗散 (P): | 1 W |
额定温度: | 70 °C | 电阻: | 11 Ω |
电阻器类型: | FIXED RESISTOR | 表面贴装: | NO |
技术: | CARBON COMPOSITION | 温度系数: | 0.15 ppm/ °C |
端子形状: | WIRE | 容差: | 10% |
工作电压: | 500 V | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
CC1-110-KAQ | RCD |
获取价格 |
Fixed Resistor, Carbon Composition, 1W, 11ohm, 500V, 10% +/-Tol, 1500ppm/Cel, Through Hole |
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CC1-110-KAW | RCD |
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Fixed Resistor, Carbon Composition, 1W, 11ohm, 500V, 10% +/-Tol, 1500ppm/Cel, Through Hole |
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CC1-110-KTW | RCD |
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Fixed Resistor, Carbon Composition, 1W, 11ohm, 500V, 10% +/-Tol, 1500ppm/Cel, Through Hole |
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CC1110-RTR1 | TI |
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True System-on-Chip with Low Power RF Transceiver and 8051 MCU |
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CC1110-RTY1 | TI |
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True System-on-Chip with Low Power RF Transceiver and 8051 MCU |
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CC1111EMK868-915 | TAOS |
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Low-power sub-1 GHz RF System-on-Chip (SoC) with MCU, memory, transceiver, and USB control |
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CC1111EMK868-915 | TI |
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Low-Power SoC (System-on-Chip) with MCU, Memory, Sub-1 GHz RF Transceiver, and USB Control |
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CC1111F16RSP | TI |
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Low-Power SoC (System-on-Chip) with MCU, Memory, Sub-1 GHz RF Transceiver, and USB Control |
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CC1111F16RSP | TAOS |
获取价格 |
Low-power sub-1 GHz RF System-on-Chip (SoC) with MCU, memory, transceiver, and USB control |
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CC1111F16RSPG3 | TI |
获取价格 |
TELECOM, CELLULAR, RF AND BASEBAND CIRCUIT |
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