VDS
ID
1000 V
22 A
@
25˚C
C3M0120100J
RDS(on)
120 mΩ
Silicon Carbide Power MOSFET
C3MTM MOSFET Technology
N-Channel Enhancement Mode
Features
Package
TAB
Drain
•ꢀ C3MTM SiC MOSFET technology
•ꢀ Low parasitic inductance with separate driver source pin
•ꢀ 7mm of creepage distance between drain and source
•ꢀ High blocking voltage with low On-resistance
•ꢀ Fast intrinsic diode with low reverse recovery (Qrr)
•ꢀ Low output capacitance (60pF)
•ꢀ Halogen free, RoHS compliant
Benefits
Drain
(TAB)
1
G
2
KS
3
S
4
S
5
S
6
S
7
S
•ꢀ Reduce switching losses and minimize gate ringing
•ꢀ Higherꢀsystemꢀefficiency
•ꢀ Reduce cooling requirements
•ꢀ Increase power density
Gate
(Pin 1)
•ꢀ Increase system switching frequency
Driver
Source
(Pin 2)
Power
Source
(Pin 3,4,5,6,7)
Applications
•ꢀ Renewable energy
•ꢀ EV battery chargers
•ꢀ High voltage DC/DC converters
•ꢀ Switch Mode Power Supplies
Marking
Part Number
Package
C3M0120100J
TO-263-7
C3M0120100J
Maximum Ratings (TCꢀ=ꢀ25ꢀ˚Cꢀunlessꢀotherwiseꢀspecified)
Symbol
Parameter
Drain - Source Voltage
Value
Unit
Test Conditions
Note
VGS = 0 V, IDꢀ=ꢀ100ꢀμA
AC (f >1 Hz)
Static
1000
-8/+19
-4/+15
22
V
V
V
VDSmax
VGSmax
VGSop
Gate - Source Voltage (dynamic)
Gate - Source Voltage (static)
Note: 1
Note: 2
Fig. 19
VGS = 15 V, TC =ꢀ25˚C
VGS = 15 V, TC =ꢀ100˚C
Continuous Drain Current
Pulsed Drain Current
A
A
ID
13.5
50
83
Fig. 22
Fig. 20
ID(pulse)
PD
Pulse width tP limited by Tjmax
Power Dissipation
W
˚C
˚C
TC=25˚C,ꢀT ꢀ=ꢀ150ꢀ˚C
J
-55 to
+150
Operating Junction and Storage Temperature
Solder Temperature
T , Tstg
J
260
1.6mm (0.063”) from case for 10s
TL
Note (1): When using MOSFET Body Diode VGSmax = -4V/+19V
Note (2): MOSFET can also safely operate at 0/+15 V
1
C3M0120100J Rev. -, 04-2017