VDS
ID
1200 V
30 A
@
25˚C
C3M0075120J
RDS(on)
75 mΩ
Silicon Carbide Power MOSFET
C3MTM MOSFET Technology
N-Channel Enhancement Mode
Features
Package
•ꢀ C3MTM SiC MOSFET technology
TAB
Drain
•ꢀ Low impedance package with driver source pin
•ꢀ 7mm of creepage distance between drain and source
•ꢀ High blocking voltage with low on-resistance
•ꢀ High-speed switching with low capacitances
•ꢀ Fast intrinsic diode with low reverse recovery (Qrr)
•ꢀ Halogen free, RoHS compliant
1
G
2
KS
3
S
4
S
5
S
6
S
7
S
Benefits
Drain
(TAB)
•ꢀ Reduce switching losses and minimize gate ringing
•ꢀ Higherꢀsystemꢀefficiency
•ꢀ Reduce cooling requirements
•ꢀ Increase power density
Gate
(Pin 1)
•ꢀ Increase system switching frequency
Driver
Source
(Pin 2)
Power
Source
(Pin 3,4,5,6,7)
Applications
•ꢀ Renewable energy
•ꢀ EV battery chargers
•ꢀ High voltage DC/DC converters
•ꢀ Switch Mode Power Supplies
Marking
Part Number
Package
C3M0075120J
TO-263-7
C3M0075120J
Maximum Ratings (TCꢀ=ꢀ25ꢀ˚Cꢀunlessꢀotherwiseꢀspecified)
Unit
Symbol
Parameter
Drain - Source Voltage
Value
Test Conditions
Note
VGS = 0 V, IDꢀ=ꢀ100ꢀμA
AC (f >1 Hz)
Static
1200
-8/+19
-4/+15
30
V
V
V
VDSmax
VGSmax
VGSop
Gate - Source Voltage (dynamic)
Gate - Source Voltage (static)
Note: 1
Note: 2
Fig. 19
VGS = 15 V, TC =ꢀ25˚C
VGS = 15 V, TC =ꢀ100˚C
Continuous Drain Current
Pulsed Drain Current
A
A
ID
19.7
80
Fig. 22
Fig. 20
ID(pulse)
PD
Pulse width tP limited by Tjmax
Power Dissipation
113.6
W
˚C
˚C
TC=25˚C,ꢀT ꢀ=ꢀ150ꢀ˚C
J
-55 to
+150
Operating Junction and Storage Temperature
Solder Temperature
T , Tstg
J
260
1.6mm (0.063”) from case for 10s
TL
Note (1): When using MOSFET Body Diode VGSmax = -4V/+19V
Note (2): MOSFET can also safely operate at 0/+15 V
1
C3M0075120J Rev. -, 07-2017