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| 型号 | 品牌 | 获取价格 | 描述 | 数据表 |
| C3225X7S1H106K | TDK |
获取价格 |
C SERIES General (Up to 50V) |
|
| C3225X7S1H106K250AB | TDK |
获取价格 |
Ceramic Capacitor, Multilayer, Ceramic, 50V, 10% +Tol, 10% -Tol, X7S, 22% TC, 10uF, Surfac |
|
| C3225X7S1H106K250AE | TDK |
获取价格 |
MULTILAYER CERAMIC CHIP CAPACITORS |
|
| C3225X7S1H106K250AE_16 | TDK |
获取价格 |
Multilayer Ceramic Chip Capacitors |
|
| C3225X7S1H106M | TDK |
获取价格 |
TDK MLCC Capacitance Offering |
|
| C3225X7S1H106M/SOFT | TDK |
获取价格 |
Ceramic Capacitor, Multilayer, Ceramic, 50V, 20% -Tol, X7S, 22% TC, 10uF, Surface Mount, 1 |
|
| C3225X7S1H106M250AB | TDK |
获取价格 |
Ceramic Capacitor, Multilayer, Ceramic, 50V, 20% +Tol, 20% -Tol, X7S, 22% TC, 10uF, Surfac |
|
| C3225X7S1H106M250AB_17 | TDK |
获取价格 |
Multilayer Ceramic Chip Capacitors |
|
| C3225X7S1H106M250AE | TDK |
获取价格 |
MULTILAYER CERAMIC CHIP CAPACITORS |
|
| C3225X7S1H106M250AE_16 | TDK |
获取价格 |
Multilayer Ceramic Chip Capacitors |
|
解析光耦仿真器：升级光耦合器技术的必要性
英伟达新一代Blackwell GPU过热问题致交付延迟
国产厂商思特威CMOS图像传感器芯片单月出货超1亿颗，技术创新引领行业发展
台积电5nm和3nm产能利用率达100%，半导体行业景气度持续攀升
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