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C3225X7S1H685M250AB_17 PDF预览

C3225X7S1H685M250AB_17

更新时间: 2024-11-27 01:22:59
品牌 Logo 应用领域
东电化 - TDK /
页数 文件大小 规格书
3页 238K
描述
Multilayer Ceramic Chip Capacitors

C3225X7S1H685M250AB_17 数据手册

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Creation Date : June 02, 2017 (GMT)  
Multilayer Ceramic Chip Capacitors  
C3225X7S1H685K250AB  
TDK item description C3225X7S1H685KT****  
Commercial Grade  
Applications  
Please refer to Part No. CGA6P3X7S1H685K250AB for Automotive use.  
General General (Up to 50V)  
Feature  
Series  
Status  
C3225 [EIA 1210]  
Production  
Size  
3.20mm ±0.40mm  
Length(L)  
Width(W)  
2.50mm ±0.30mm  
2.50mm ±0.30mm  
0.20mm Min.  
Thickness(T)  
Terminal Width(B)  
Terminal Spacing(G)  
Recommended Land Pattern (PA)  
Recommended Land Pattern (PB)  
Recommended Land Pattern (PC)  
2.00mm to 2.40mm  
1.00mm to 1.20mm  
1.90mm to 2.50mm  
Electrical Characteristics  
Capacitance  
6.8μF ±10%  
50VDC  
Rated Voltage  
Temperature Characteristic  
Dissipation Factor (Max.)  
Insulation Resistance (Min.)  
X7S(±22%)  
5%  
73MΩ  
Other  
Soldering Method  
AEC-Q200  
Reflow  
No  
Packing  
Blister (Plastic)Taping [180mm Reel]  
1000pcs  
Package Quantity  
! Images are for reference only and show exemplary products.  
! This PDF document was created based on the data listed on the TDK Corporation website.  
! All specifications are subject to change without notice.  
Copyright(c) TDK Corporation. All rights reserved.  

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