Datasheet > C3225X7S1H106M250AB_17

C3225X7S1H106M250AB_17

更新时间： 2024-11-24 01:22:59

品牌	Logo	应用领域
东电化 - TDK		/
页数	文件大小	规格书
3页	238K
描述
Multilayer Ceramic Chip Capacitors

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Creation Date : June 02, 2017 (GMT)

Multilayer Ceramic Chip Capacitors

C3225X7S1H106M250AB

TDK item description C3225X7S1H106MT****

Commercial Grade

Applications

Please refer to Part No. CGA6P3X7S1H106M250AB for Automotive use.

General General (Up to 50V)

Feature

Series

Status

C3225 [EIA 1210]

Production

Size

3.20mm ±0.40mm

Length(L)

Width(W)

2.50mm ±0.30mm

0.20mm Min.

Thickness(T)

Terminal Width(B)

Terminal Spacing(G)

Recommended Land Pattern (PA)

Recommended Land Pattern (PB)

Recommended Land Pattern (PC)

2.00mm to 2.40mm

1.00mm to 1.20mm

1.90mm to 2.50mm

Electrical Characteristics

Capacitance

10μF ±20%

50VDC

Rated Voltage

Temperature Characteristic

Dissipation Factor (Max.)

Insulation Resistance (Min.)

X7S(±22%)

50MΩ

Other

Soldering Method

AEC-Q200

Reﬂow

Packing

Blister (Plastic)Taping [180mm Reel]

1000pcs

Package Quantity

! Images are for reference only and show exemplary products.

! This PDF document was created based on the data listed on the TDK Corporation website.

! All speciﬁcations are subject to change without notice.

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