Datasheet > C2012X6S1C685M125AC_17

C2012X6S1C685M125AC_17

更新时间： 2024-11-06 01:17:39

品牌	Logo	应用领域
东电化 - TDK		/
页数	文件大小	规格书
3页	233K
描述
Multilayer Ceramic Chip Capacitors

阅读下载

中文翻译

获取价格

数据手册

如果您发现信息不准确，欢迎纠错

C2012X6S1C685M125AC_17 数据手册

浏览型号C2012X6S1C685M125AC_17的Datasheet PDF文件第2页

浏览型号C2012X6S1C685M125AC_17的Datasheet PDF文件第3页

1 of 3

Creation Date : May 19, 2017 (GMT)

Multilayer Ceramic Chip Capacitors

C2012X6S1C685K125AC

TDK item description C2012X6S1C685KT****

Applications

Commercial Grade

Feature

Series

Status

General General (Up to 50V)

C2012 [EIA 0805]

Production

Size

2.00mm ±0.20mm

Length(L)

Width(W)

1.25mm ±0.20mm

0.20mm Min.

Thickness(T)

Terminal Width(B)

Terminal Spacing(G)

0.50mm Min.

1.00mm to 1.30mm(Flow Soldering)

0.90mm to 1.20mm(Reﬂow Soldering)

Recommended Land Pattern (PA)

Recommended Land Pattern (PB)

Recommended Land Pattern (PC)

1.00mm to 1.20mm(Flow Soldering)

0.70mm to 0.90mm(Reﬂow Soldering)

0.80mm to 1.10mm(Flow Soldering)

0.90mm to 1.20mm(Reﬂow Soldering)

Electrical Characteristics

Capacitance

6.8μF ±10%

16VDC

Rated Voltage

Temperature Characteristic

Dissipation Factor (Max.)

Insulation Resistance (Min.)

X6S(±22%)

10%

14MΩ

Other

Wave (Flow)

Reﬂow

Soldering Method

AEC-Q200

Packing

Blister (Plastic)Taping [180mm Reel]

2000pcs

Package Quantity

! Images are for reference only and show exemplary products.

! This PDF document was created based on the data listed on the TDK Corporation website.

! All speciﬁcations are subject to change without notice.

12 3

中文翻译

下载PDF

与C2012X6S1C685M125AC_17相关器件

型号	品牌	获取价格	描述	数据表
C2012X6S1E010BTXXXX	TDK	获取价格	General Application
C2012X6S1E010WTXXXX	TDK	获取价格	General Application
C2012X6S1E0R5BTXXXX	TDK	获取价格	General Application
C2012X6S1E0R5WTXXXX	TDK	获取价格	General Application
C2012X6S1E102BTXXXX	TDK	获取价格	General Application
C2012X6S1E102WTXXXX	TDK	获取价格	General Application
C2012X6S1E105K085AB	TDK	获取价格	CAP CER 1UF 25V X6S 0805
C2012X6S1E105M085AB	TDK	获取价格	CAP CER 1UF 25V X6S 0805
C2012X6S1E105WTXXXX	TDK	获取价格	General Application
C2012X6S1E107B020AA	TDK	获取价格	MULTILAYER CERAMIC CHIP CAPACITORS