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C1608X5R1C475K080AC_17 PDF预览

C1608X5R1C475K080AC_17

更新时间: 2024-11-05 01:22:15
品牌 Logo 应用领域
东电化 - TDK /
页数 文件大小 规格书
3页 232K
描述
Multilayer Ceramic Chip Capacitors

C1608X5R1C475K080AC_17 数据手册

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1 of 3  
Creation Date : April 25, 2017 (GMT)  
Multilayer Ceramic Chip Capacitors  
C1608X5R1C475K080AC  
TDK item description C1608X5R1C475KT****  
Applications  
Commercial Grade  
Feature  
Series  
Status  
General General (Up to 50V)  
C1608 [EIA 0603]  
Production  
Size  
1.60mm ±0.10mm  
Length(L)  
Width(W)  
0.80mm ±0.10mm  
0.80mm ±0.10mm  
0.20mm Min.  
Thickness(T)  
Terminal Width(B)  
Terminal Spacing(G)  
0.30mm Min.  
0.70mm to 1.00mm(Flow Soldering)  
0.60mm to 0.80mm(Reflow Soldering)  
Recommended Land Pattern (PA)  
Recommended Land Pattern (PB)  
Recommended Land Pattern (PC)  
0.80mm to 1.00mm(Flow Soldering)  
0.60mm to 0.80mm(Reflow Soldering)  
0.60mm to 0.80mm(Flow Soldering)  
0.60mm to 0.80mm(Reflow Soldering)  
Electrical Characteristics  
Capacitance  
4.7μF ±10%  
16VDC  
Rated Voltage  
Temperature Characteristic  
Dissipation Factor (Max.)  
Insulation Resistance (Min.)  
X5R(±15%)  
10%  
21MΩ  
Other  
Wave (Flow)  
Reflow  
Soldering Method  
AEC-Q200  
No  
Packing  
Punched (Paper)Taping [180mm Reel]  
4000pcs  
Package Quantity  
! Images are for reference only and show exemplary products.  
! This PDF document was created based on the data listed on the TDK Corporation website.  
! All specifications are subject to change without notice.  
Copyright(c) TDK Corporation. All rights reserved.  

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