Datasheet > C1210C224K5RAC

C1210C224K5RAC

更新时间： 2024-11-05 22:32:35

品牌	Logo	应用领域
基美 - KEMET		/
页数	文件大小	规格书
4页	60K
描述
CERAMIC CHIP CAPACITORS

阅读下载

中文翻译

获取价格

技术参数
数据手册
替代型号

如果您发现信息不准确，欢迎纠错

C1210C224K5RAC 技术参数

是否无铅：	不含铅	是否Rohs认证：	符合
生命周期：	Active	零件包装代码：	1210
包装说明：	, 1210	Reach Compliance Code：	compliant
ECCN代码：	EAR99	HTS代码：	8532.24.00.20
风险等级：	5.19	电容：	0.22 µF
电容器类型：	CERAMIC CAPACITOR	介电材料：	CERAMIC
高度：	0.9 mm	JESD-609代码：	e3
长度：	3.2 mm	安装特点：	SURFACE MOUNT
多层：	Yes	负容差：	10%
端子数量：	2	最高工作温度：	125 °C
最低工作温度：	-55 °C	封装形状：	RECTANGULAR PACKAGE
封装形式：	SMT	包装方法：	Bulk
正容差：	10%	额定（直流）电压（URdc）：	50 V
尺寸代码：	1210	表面贴装：	YES
温度特性代码：	X7R	温度系数：	15% ppm/ °C
端子面层：	Matte Tin (Sn) - with Nickel (Ni) barrier	端子形状：	WRAPAROUND
宽度：	2.5 mm	Base Number Matches：	1

C1210C224K5RAC 数据手册

KEMET^®

CERAMIC CHIP CAPACITORS

FEATURES

• C0G (NP0), X7R, X5R, Z5U and Y5V Dielectrics

• Tape and reel packaging per EIA481-1. (See page

• 10, 16, 25, 50, 100 and 200 Volts

• Standard End Metalization: Tin-plate over nickel

barrier

61 for specific tape and reel information.) Bulk

Cassette packaging (0402, 0603, 0805 only) per

IEC60286-6 and EIAJ 7201.

• Available Capacitance Tolerances: ±0.10 pF; ±0.25

pF; ±0.5 pF; ±1% ; ±2% ; ±5% ; ±10% ; ±20% ; and

+80% -20%

CAPACITOR OUTLINE DRAWINGS

TIN PLATE

NICKEL PLATE

CONDUCTIVE

METALLIZATION

ELECTRODES

DIMENSIONS—MILLIMETERS AND (INCHES)

METRIC

SIZE CODE

(Ref only)

L #

W #

MOUNTING

TECHNIQUE

Solder Reflow

EIA

SIZE CODE

LENGTH

WIDTH

BANDWIDTH

MIN. SEPARATION

1.0 (.04) ± .05(.002)

0.5 (.02) ± .05 (.002)

0.20 (0.008)-0.40 (0.016)

0.3 (.012)

0402*

0603*

0805*

1206*

1210*

1812

1005

1608

2012

3216

3225

4532

4564

5650

5664

1.6 (.063) ± 0.15 (.006)

2.0 (.079) ± 0.2 (.008)

3.2 (.126) ± 0.2 (.008)

4.5 (.177) ± 0.3 (.012)

5.6 (.220) ± 0.4 (.016)

0.8 (.032) ± 0.15 (.006)

1.25 (.049) ± 0.2 (.008)

1.6 (.063) ± 0.2 (.008)

2.5 (.098) ± 0.2 (.008)

3.2 (.126) ± 0.3 (.012)

6.4 (.252) ± 0.4 (.016)

5.0 (.197) ± 0.4 (.016)

6.3 (.248) ± 0.4 (.016)

0.35 (.014) ±0.15 (.006)

0.5 (.02) ±.25 (.010)

0.6 (.024) ±.35 (.014)

0.7 (.028)

0.75 (.030)

N/A

See pages

48-52 for

thickness

Solder Wave †

Solder Reflow

N/A

dimensions.

N/A

1825*

2220

Solder

Reflow

N/A

2225

* Note: Indicates EIA Preferred Case Sizes (Tightened tolerances apply for 0402, 0603, and 0805 packaged in bulk cassette, see page 65.)

#Note: These thicknesses are EIA maximums. Most chips are considerably thinner. Consult factory for details. Also, some extended values may be slightly thicker than EIA maximums.

† For extended value 1210 case size – solder reflow only.

(Standard Chips - For

Military see page 55)

CAPACITOR ORDERING INFORMATION

C 0805 C 103 K 5 R A C*

CERAMIC

SIZE CODE

END METALLIZATION

C-Standard

SPECIFICATION

C - Standard

CAPACITANCE CODE

(Tin-plated nickel barrier)

FAILURE RATE LEVEL

A- Not Applicable

Expressed in Picofarads (pF)

TEMPERATURE CHARACTERISTIC

Designated by Capacitance

First two digits represent significant figures.

Third digit specifies number of zeros. (Use 9

for 1.0 through 9.9pF. Use 8 for 0.5 through 0.99pF)

(Example: 2.2pF = 229 or 0.50 pF = 508)

CAPACITANCE TOLERANCE

Change Over Temperature Range

G – C0G (NP0) (±30 PPM/°C)

R – X7R (±15% ) (-55°C + 125°C)

P– X5R (±15% ) (-55°C + 85°C)

U – Z5U (+22% , -56% ) (+10°C + 85°C)

V – Y5V (+22% , -82% ) (-30°C + 85°C)

VOLTAGE

B – ±0.10pF J – ±5%

C – ±0.25pF K – ±10%

D – ±0.5pF

F – ±1%

G – ±2%

M – ±20%

P – (GMV) – special order only

Z – +80% , -20%

1 - 100V

2 - 200V

5 - 50V

3 - 25V

4 - 16V

8 - 10V

9 - 6.3V

* Part Number Example: C0805C103K5RAC (14 digits - no spaces)

KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300

12 3 4

中文翻译

下载PDF

C1210C224K5RAC 替代型号

型号	品牌	替代类型	描述	数据表
C1210C224K5RACTU	KEMET	功能相似	Capacitor, Ceramic, Chip, General Purpose, 0.

与C1210C224K5RAC相关器件

型号	品牌	获取价格	描述	数据表
C1210C224K5RACTM	KEMET	获取价格	Capacitor, Ceramic, Chip, General Purpose, 0.
C1210C224K5RACTU	KEMET	获取价格	Capacitor, Ceramic, Chip, General Purpose, 0.
C1210C224KARACAUTO	KEMET	获取价格	SMD Auto X7R, Ceramic, 0.22 uF, 10%, 250 V, X7R, SMD, MLCC, Temperature Stable, Automotive
C1210C224KARACTU	KEMET	获取价格	SMD Comm X7R Tip-Ring, Ceramic, 0.22 uF, 10%, 250 V, X7R, SMD, MLCC, Temperature Stable, S
C1210C224M3GAC	KEMET	获取价格	Surface Mount Ceramic Chip Capacitors - C0G Dielectric
C1210C224M3GAC3325	KEMET	获取价格	Ceramic Capacitor, Multilayer, Ceramic, 25V, 20% +Tol, 20% -Tol, C0G, -/+30ppm/Cel TC, 0.2
C1210C224M3GAC7025	KEMET	获取价格	Ceramic Capacitor, Multilayer, Ceramic, 25V, 20% +Tol, 20% -Tol, C0G, -/+30ppm/Cel TC, 0.2
C1210C224M3GAC7215	KEMET	获取价格	Ceramic Capacitor, Multilayer, Ceramic, 25V, 20% +Tol, 20% -Tol, C0G, -/+30ppm/Cel TC, 0.2
C1210C224M3GACTU	KEMET	获取价格	Ceramic Capacitor, Multilayer, Ceramic, 25V, 20% +Tol, 20% -Tol, C0G, 30ppm/Cel TC, 0.22uF
C1210C224M5JACTU	KEMET	获取价格	SMD Comm U2J, Ceramic, 0.22 uF, 20%, 50 V, U2J, SMD, MLCC, Ultra-Stable, Low Loss, Class I

与C1210C224K5RAC相关文章

英伟达新AI芯片Rubin或提前半年亮相
2024-11-05

14
苹果iPhone 17将全系采用三星/LG显示LTPO OLED面板
2024-11-05

12
三星深化印度制造布局，供应链本地化进程加速
2024-10-29

36
芯擎科技“星辰一号”自动驾驶芯片点亮成功，2025年量产在即
2024-10-29

33

产品中心

服务支持

精选活动

关于我们

帮助中心

C1210C224K5RAC

C1210C224K5RAC 技术参数

C1210C224K5RAC 数据手册

C1210C224K5RAC 替代型号

与C1210C224K5RAC相关器件

与C1210C224K5RAC相关文章

您还可以找

产品中心

服务支持

精选活动

关于我们

帮助中心

C1210C224K5RAC

C1210C224K5RAC 技术参数

C1210C224K5RAC 数据手册

C1210C224K5RAC 替代型号

与C1210C224K5RAC相关器件

与C1210C224K5RAC相关文章

您还可以找

您在本页遇到什么问题？