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C1210C224M5RAC

更新时间： 2024-11-05 22:30:35
品牌 Logo 应用领域
基美 - KEMET /
页数 文件大小 规格书
4页 60K
描述
CERAMIC CHIP CAPACITORS

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中文翻译

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C1210C224M5RAC 技术参数

是否无铅： 不含铅是否Rohs认证： 符合
生命周期：Active零件包装代码：1210
包装说明：, 1210Reach Compliance Code：compliant
ECCN代码：EAR99HTS代码：8532.24.00.20
风险等级：5.37电容：0.22 µF
电容器类型：CERAMIC CAPACITOR介电材料：CERAMIC
高度：0.9 mmJESD-609代码：e3
长度：3.2 mm安装特点：SURFACE MOUNT
多层：Yes负容差：20%
端子数量：2最高工作温度：125 °C
最低工作温度：-55 °C封装形状：RECTANGULAR PACKAGE
封装形式：SMT包装方法：TR, EMBOSSED PLASTIC, 7/13 INCH
正容差：20%额定（直流）电压（URdc）：50 V
尺寸代码：1210表面贴装：YES
温度特性代码：X7R温度系数：15% ppm/ °C
端子面层：Matte Tin (Sn) - with Nickel (Ni) barrier端子形状：WRAPAROUND
宽度：2.5 mm

C1210C224M5RAC 数据手册

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KEMET®  
CERAMIC CHIP CAPACITORS  
FEATURES  
• C0G (NP0), X7R, X5R, Z5U and Y5V Dielectrics  
• Tape and reel packaging per EIA481-1. (See page  
• 10, 16, 25, 50, 100 and 200 Volts  
• Standard End Metalization: Tin-plate over nickel  
barrier  
61 for specific tape and reel information.) Bulk  
Cassette packaging (0402, 0603, 0805 only) per  
IEC60286-6 and EIAJ 7201.  
• Available Capacitance Tolerances: ±0.10 pF; ±0.25  
pF; ±0.5 pF; ±1% ; ±2% ; ±5% ; ±10% ; ±20% ; and  
+80% -20%  
CAPACITOR OUTLINE DRAWINGS  
TIN PLATE  
L
W
B
T
NICKEL PLATE  
S
CONDUCTIVE  
METALLIZATION  
ELECTRODES  
DIMENSIONS—MILLIMETERS AND (INCHES)  
METRIC  
SIZE CODE  
(Ref only)  
L #  
W #  
B
S
MOUNTING  
TECHNIQUE  
Solder Reflow  
EIA  
SIZE CODE  
LENGTH  
WIDTH  
BANDWIDTH  
MIN. SEPARATION  
1.0 (.04) ± .05(.002)  
0.5 (.02) ± .05 (.002)  
0.20 (0.008)-0.40 (0.016)  
0.3 (.012)  
0402*  
0603*  
0805*  
1206*  
1210*  
1812  
1005  
1608  
2012  
3216  
3225  
4532  
4564  
5650  
5664  
1.6 (.063) ± 0.15 (.006)  
2.0 (.079) ± 0.2 (.008)  
3.2 (.126) ± 0.2 (.008)  
3.2 (.126) ± 0.2 (.008)  
4.5 (.177) ± 0.3 (.012)  
4.5 (.177) ± 0.3 (.012)  
5.6 (.220) ± 0.4 (.016)  
5.6 (.220) ± 0.4 (.016)  
0.8 (.032) ± 0.15 (.006)  
1.25 (.049) ± 0.2 (.008)  
1.6 (.063) ± 0.2 (.008)  
2.5 (.098) ± 0.2 (.008)  
3.2 (.126) ± 0.3 (.012)  
6.4 (.252) ± 0.4 (.016)  
5.0 (.197) ± 0.4 (.016)  
6.3 (.248) ± 0.4 (.016)  
0.35 (.014) ±0.15 (.006)  
0.5 (.02) ±.25 (.010)  
0.5 (.02) ±.25 (.010)  
0.5 (.02) ±.25 (.010)  
0.6 (.024) ±.35 (.014)  
0.6 (.024) ±.35 (.014)  
0.6 (.024) ±.35 (.014)  
0.6 (.024) ±.35 (.014)  
0.7 (.028)  
0.75 (.030)  
N/A  
See pages  
48-52 for  
thickness  
Solder Wave †  
or  
Solder Reflow  
N/A  
dimensions.  
N/A  
N/A  
1825*  
2220  
Solder  
Reflow  
N/A  
N/A  
2225  
* Note: Indicates EIA Preferred Case Sizes (Tightened tolerances apply for 0402, 0603, and 0805 packaged in bulk cassette, see page 65.)  
#Note: These thicknesses are EIA maximums. Most chips are considerably thinner. Consult factory for details. Also, some extended values may be slightly thicker than EIA maximums.  
† For extended value 1210 case size – solder reflow only.  
(Standard Chips - For  
Military see page 55)  
CAPACITOR ORDERING INFORMATION  
C 0805 C 103 K 5 R A C*  
CERAMIC  
SIZE CODE  
END METALLIZATION  
C-Standard  
SPECIFICATION  
C - Standard  
CAPACITANCE CODE  
(Tin-plated nickel barrier)  
FAILURE RATE LEVEL  
A- Not Applicable  
Expressed in Picofarads (pF)  
TEMPERATURE CHARACTERISTIC  
Designated by Capacitance  
First two digits represent significant figures.  
Third digit specifies number of zeros. (Use 9  
for 1.0 through 9.9pF. Use 8 for 0.5 through 0.99pF)  
(Example: 2.2pF = 229 or 0.50 pF = 508)  
CAPACITANCE TOLERANCE  
Change Over Temperature Range  
G – C0G (NP0) (±30 PPM/°C)  
R – X7R (±15% ) (-55°C + 125°C)  
P– X5R (±15% ) (-55°C + 85°C)  
U – Z5U (+22% , -56% ) (+10°C + 85°C)  
V – Y5V (+22% , -82% ) (-30°C + 85°C)  
VOLTAGE  
B – ±0.10pF J – ±5%  
C – ±0.25pF K – ±10%  
D – ±0.5pF  
F – ±1%  
G – ±2%  
M – ±20%  
P – (GMV) – special order only  
Z – +80% , -20%  
1 - 100V  
2 - 200V  
5 - 50V  
3 - 25V  
4 - 16V  
8 - 10V  
9 - 6.3V  
* Part Number Example: C0805C103K5RAC (14 digits - no spaces)  
49  
KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300  
1234

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C1210C224M5RAC 替代型号

型号 品牌 替代类型 描述 数据表
C1210C224M5RACTU KEMET

功能相似

 Capacitor, Ceramic, Chip, General Purpose, 0.

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