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C005ZK8R2DBWTR500 PDF预览

C005ZK8R2DBWTR500

更新时间: 2024-10-29 02:26:59
品牌 Logo 应用领域
京瓷/艾维克斯 - KYOCERA AVX /
页数 文件大小 规格书
25页 1238K
描述
Thin-Film Technology

C005ZK8R2DBWTR500 数据手册

 浏览型号C005ZK8R2DBWTR500的Datasheet PDF文件第19页浏览型号C005ZK8R2DBWTR500的Datasheet PDF文件第20页浏览型号C005ZK8R2DBWTR500的Datasheet PDF文件第21页浏览型号C005ZK8R2DBWTR500的Datasheet PDF文件第22页浏览型号C005ZK8R2DBWTR500的Datasheet PDF文件第23页浏览型号C005ZK8R2DBWTR500的Datasheet PDF文件第25页 
®
Accu-P  
Application Notes  
PREHEAT & SOLDERING  
CLEANING RECOMMENDATIONS  
The rate of preheat in production should not exceed 4ꢀC/  
second and a recommended maximum is about 2ꢀC/second.  
Temperature differential from preheat to soldering should not  
exceed 100ꢀC.  
For further specific application or process advice, please consult  
AVX.  
Care should be taken to ensure that the devices are  
thoroughly cleaned of flux residues, especially the space  
beneath the device. Such residues may otherwise become  
conductive and effectively offer a lossy bypass to the device.  
Various recommended cleaning conditions (which must be  
optimized for the flux system being used) are as follows:  
Cleaning liquids. . . . . . . i-propanol, ethanol, acetylacetone,  
water and other standard PCB  
COOLING  
cleaning liquids.  
After soldering, the assembly should preferably be allowed  
to cool naturally. In the event of assisted cooling, similar  
conditions to those recommended for preheating should be  
used.  
Ultrasonic conditions . . power-20w/liter max.  
frequency-20kHz to 45kHz.  
Temperature. . . . . . . . . 80ꢀC maximum (if not otherwise  
limited by chosen solvent system).  
Time . . . . . . . . . . . . . . . 5 minutes max.  
HAND SOLDERING & REWORK  
Hand soldering is permissible. Preheat of the PCB to 150ꢀC is  
required. The most preferable technique is to use hot air sol-  
dering tools. Where a soldering iron is used, a temperature  
controlled model not exceeding 30 watts should be used and  
set to not more than 260ꢀC.  
STORAGE CONDITIONS  
Recommended storage conditions for Accu-P® prior to use  
are as follows:  
Temperature . . . . . . . . . . 15ꢀC to 35ꢀC  
Humidity . . . . . . . . . . . . . ≤65ꢁ  
Air Pressure . . . . . . . . . . 860mbar to 1060mbar  
RECOMMENDED REFLOW  
SOLDERING PROFILE  
COMPONENTS WITH  
SnPb TERMINATIONS  
RECOMMENDED REFLOW  
SOLDERING PROFILE  
LEAD FREE  
COMPONENTS WITH  
Sn100 TERMINATIONS  
330  
Peak Temperature = 260ºC  
260  
250  
200  
150  
100  
50  
0
0:00  
0:43  
1:28  
2:10  
2:53  
3:36  
Time  
4:19  
5:02  
5:48  
6:29  
050118  
29  

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