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C005ZK8R2DBWTR500 PDF预览

C005ZK8R2DBWTR500

更新时间: 2024-10-29 02:26:59
品牌 Logo 应用领域
京瓷/艾维克斯 - KYOCERA AVX /
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25页 1238K
描述
Thin-Film Technology

C005ZK8R2DBWTR500 数据手册

 浏览型号C005ZK8R2DBWTR500的Datasheet PDF文件第19页浏览型号C005ZK8R2DBWTR500的Datasheet PDF文件第20页浏览型号C005ZK8R2DBWTR500的Datasheet PDF文件第21页浏览型号C005ZK8R2DBWTR500的Datasheet PDF文件第23页浏览型号C005ZK8R2DBWTR500的Datasheet PDF文件第24页浏览型号C005ZK8R2DBWTR500的Datasheet PDF文件第25页 
®
Accu-P  
Performance Characteristics RF Power Applications  
ESR and therefore RF heating. Values of ESR for  
RF POWER APPLICATIONS  
In RF power applications capacitor losses generate heat. Two  
factors of particular importance to designers are:  
Accu-P® capacitors are significantly less than those of  
ceramic MLC components currently available.  
• Minimizing the generation of heat.  
• Dissipating heat as efficiently as possible.  
HEAT DISSIPATION  
• Heat is dissipated from a capacitor through a variety of  
paths, but the key factor in the removal of heat is the  
thermal conductivity of the capacitor material.  
• The higher the thermal conductivity of the capacitor, the  
more rapidly heat will be dissipated.  
• The table below illustrates the importance of thermal  
conductivity to the performance of Accu-P® in power  
applications.  
CAPACITOR HEATING  
• The major source of heat generation in a capacitor in RF  
power applications is a function of RF current (I) and ESR,  
from the relationship:  
Power dissipation = I2RMS x ESR  
• Accu-P® capacitors are specially designed to minimize  
PRODUCT  
MATERIAL  
Alumina  
Magnesium Titanate  
THERMAL CONDUCTIVITY WꢀmK  
Accu-P®  
18.9  
6.0  
Microwave MLC  
Power Handling  
®
Accu-P 10pF  
Data used in calculating the graph:  
Thermal impedance of capacitors:  
0402  
0603  
0805  
1210  
17ꢀC/W  
12ꢀC/W  
6.5ꢀC/W  
5ꢀC/W  
Thermal impedance measured using RF generator,  
amplifier and strip-line transformer.  
ESR of capacitors measured on Boonton 34A  
The thermal impedance expresses the temperature difference  
in ꢀC between chip center and termination caused by  
a power dissipation of 1 watt in the chip. It is expressed in  
ꢀC/W.  
THERMAL IMPEDANCE  
Thermal impedance of Accu-P® chips is shown below com-  
pared with the thermal impedance of Microwave MLC’s.  
CAPACITOR TYPE  
Accu-P®  
CHIP SIZE  
0805  
1210  
THERMAL IMPEDANCE (°C/W)  
6.5  
5
Microwave MLC  
0505  
1210  
12  
7.5  
ADVANTAGES OF ACCU-P®  
IN RF POWER CIRCUITS  
PRACTICAL APPLICATION  
IN RF POWER CIRCUITS  
• There is a wide variety of different experimental methods  
for measuring the power handling performance of a  
capacitor in RF power circuits. Each method has its  
own problems and few of them exactly reproduce the  
conditions present in “real” circuit applications.  
• Similarly, there is a very wide range of different circuit appli-  
cations, all with their unique characteristics and operating  
conditions which cannot possibly be covered by such  
“theoretical” testing.  
The optimized design of Accu-P® offers the designer of RF  
power circuits the following advantages:  
• Reduced power losses due to the inherently low ESR of  
Accu-P®.  
• Increased power dissipation due to the high thermal  
conductivity of Accu-P®.  
• THE ONLY TRUE TEST OF A CAPACITOR IN ANY PARTICULAR  
APPLICATION IS ITS PERFORMANCE UNDER OPERATING  
CONDITIONS IN THE ACTUAL CIRCUIT.  
050118  
27  

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