BZX84BxxxLT1,
BZX84CxxxLT1 Series,
SZBZX84BxxxLT1G,
SZBZX84CxxxLT1G Series
Zener Voltage Regulators
http://onsemi.com
225 mW SOT−23 Surface Mount
3
1
This series of Zener diodes is offered in the convenient, surface
mount plastic SOT−23 package. These devices are designed to provide
voltage regulation with minimum space requirement. They are well
suited for applications such as cellular phones, hand held portables,
and high density PC boards.
Cathode
Anode
MARKING DIAGRAM
3
SOT−23
CASE 318
STYLE 8
xxx M G
G
1
Features
2
1
• 225 mW Rating on FR−4 or FR−5 Board
• Zener Breakdown Voltage Range − 2.4 V to 75 V
• Package Designed for Optimal Automated Board Assembly
• Small Package Size for High Density Applications
• ESD Rating of Class 3 (>16 kV) per Human Body Model
• Tight Tolerance Series Available (See Page 4)
• AEC−Q101 Qualified and PPAP Capable
xxx
M
G
= Device Code
= Date Code*
= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation may vary depending
upon manufacturing location.
ORDERING INFORMATION
†
Device
Package
Shipping
• SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements
BZX84CxxxLT1
SOT−23 3000/Tape & Reel
• Pb−Free Packages are Available
BZX84CxxxLT1G
SOT−23 3000/Tape & Reel
(Pb−Free)
Mechanical Characteristics
SZBZX84xxxLT1G
BZX84CxxxLT3
SOT−23 3000/Tape & Reel
(Pb−Free)
CASE: Void-free, transfer-molded, thermosetting plastic case
FINISH: Corrosion resistant finish, easily Solderable
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:
260°C for 10 Seconds
POLARITY: Cathode indicated by polarity band
FLAMMABILITY RATING: UL 94 V−0
SOT−23
10,000/Tape &
Reel
BZX84CxxxLT3G
SOT−23
(Pb−Free)
10,000/Tape &
Reel
SZBZXCxxxLT3G
SOT−23
(Pb−Free)
10,000/Tape &
Reel
MAXIMUM RATINGS
BZX84BxxxLT1
SOT−23 3000/Tape & Reel
Rating
Symbol
Max
Unit
BZX84BxxxLT1G
SOT−23
(Pb−Free)
3000 / Tape &
Reel
Total Power Dissipation on FR−5 Board,
(Note 1) @ T = 25°C
Derated above 25°C
P
D
225
1.8
556
mW
mW/°C
°C/W
A
SZBZX84BxxxLT1G SOT−23
(Pb−Free)
3000 / Tape &
Reel
Thermal Resistance, Junction−to−Ambient
R
q
JA
BZX84BxxxLT3
SOT−23
10,000 / Tape &
Reel
Total Power Dissipation on Alumina
P
D
Substrate, (Note 2) @ T = 25°C
300
2.4
417
mW
mW/°C
°C/W
A
BZX84BxxxLT3G
SOT−23
(Pb−Free)
10,000/Tape &
Reel
Derated above 25°C
Thermal Resistance, Junction−to−Ambient
R
q
JA
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Junction and Storage Temperature Range
T , T
−65 to
+150
°C
J
stg
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. FR−5 = 1.0 X 0.75 X 0.62 in.
DEVICE MARKING INFORMATION
See specific marking information in the device marking
column of the Electrical Characteristics table on page 3 of
this data sheet.
2. Alumina = 0.4 X 0.3 X 0.024 in., 99.5% alumina.
© Semiconductor Components Industries, LLC, 2011
1
Publication Order Number:
November, 2011 − Rev. 14
BZX84C2V4LT1/D