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BZX584C56-AU PDF预览

BZX584C56-AU

更新时间: 2024-11-07 14:51:31
品牌 Logo 应用领域
强茂 - PANJIT /
页数 文件大小 规格书
6页 71K
描述
SOD-523

BZX584C56-AU 数据手册

 浏览型号BZX584C56-AU的Datasheet PDF文件第2页浏览型号BZX584C56-AU的Datasheet PDF文件第3页浏览型号BZX584C56-AU的Datasheet PDF文件第4页浏览型号BZX584C56-AU的Datasheet PDF文件第5页浏览型号BZX584C56-AU的Datasheet PDF文件第6页 
BZX584C2V4-AU SERIES  
SURFACE MOUNT SILICON ZENER DIODES  
POWER  
VOLTAGE  
200 mWatt  
2.4 to 75 Volt  
FEATURES  
• Planar Die construction  
• 200mW Power Dissipation  
• Zener Voltages from 2.4V~75V  
0.050(1.25)  
0.045(1.15)  
• Ideally Suited for Automated Assembly Processes  
• Acquire quality system certificate : TS16949  
• AEC-Q101 qualified  
0.014(0.35)  
0.009(0.25)  
0.034(0.85)  
0.029(0.75)  
0.026(0.65)  
0.021(0.55)  
• Lead free in compliance with EU RoHS 2011/65/EU directive  
• Green molding compound as per IEC61249 Std. . (Halogen Free)  
0.006(0.15)  
0.002(0.05)  
0.067(1.70)  
0.059(1.50)  
MECHANICALDATA  
• Case: SOD-523, Plastic  
Terminals: Solderable per MIL-STD-750, Method 2026  
• Standard packaging: 8mm tape  
0.20 MIN.  
• Apporx. Weight: 0.00005 ounces, 0.00143 grams  
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS  
PARAMETER  
SYMBOL  
VALUE  
200  
UNITS  
Power Dissipation @T  
A
=25oC(Note A)  
P
D
mW  
OC  
Operating Junction and Storage Temperature Range  
TJ  
-55 to +150  
NOTES :  
A. Mounted on 100cm2(1mm thick) copper areas.  
PAGE . 1  
September 29,2016-REV.04  

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