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BZT52C3V6LP PDF预览

BZT52C3V6LP

更新时间: 2024-11-21 09:04:31
品牌 Logo 应用领域
美台 - DIODES 稳压二极管
页数 文件大小 规格书
4页 150K
描述
SURFACE MOUNT ZENER DIODE

BZT52C3V6LP 数据手册

 浏览型号BZT52C3V6LP的Datasheet PDF文件第2页浏览型号BZT52C3V6LP的Datasheet PDF文件第3页浏览型号BZT52C3V6LP的Datasheet PDF文件第4页 
BZT52C2V4LP - BZT52C39LP  
SURFACE MOUNT ZENER DIODE  
Please click here to visit our online spice models database.  
Features  
Mechanical Data  
Ultra-Small Leadless Surface Mount Package  
Case: DFN1006-2  
Case Material: Molded Plastic, "Green" Molding Compound.  
UL Flammability Classification Rating 94V-0  
Moisture Sensitivity: Level 1 per J-STD-020D  
Terminal Connections: Cathode Dot (See Marking Information)  
Ideally Suited for Automated Assembly Processes  
Lead Free By Design/RoHS Compliant (Note 1)  
"Green" Device (Note 2)  
Qualified to AEC-Q101 Standards for High Reliability  
Terminals: Finish NiPdAu Over Copper Leadframe.  
Solderable per MIL-STD-202, Method 208  
Marking Information: See Page 3  
Ordering Information: See Page 3  
Weight: 0.001 grams  
Bottom View  
Maximum Ratings @TA = 25°C unless otherwise specified  
Characteristic  
Symbol  
Value  
Unit  
0.9  
V
Forward Voltage (Note 4)  
@ IF = 10mA  
VF  
Thermal Characteristics  
Characteristic  
Symbol  
PD  
Value  
250  
Unit  
mW  
Power Dissipation  
(Note 3) TA = 25°C  
(Note 3) TA = 25°C  
500  
Thermal Resistance, Junction to Ambient Air  
Operating and Storage Temperature Range  
°C/W  
°C  
Rθ  
JA  
-65 to +150  
TJ, TSTG  
Notes:  
1. No purposefully added lead.  
2. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.  
3. Device mounted on FR-4 PCB with minimum recommended pad layout pattern as shown on page 4.  
4. Short duration pulse test used to minimize self-heating effect.  
1 of 4  
www.diodes.com  
August 2008  
© Diodes Incorporated  
BZT52C2V4LP - BZT52C39LP  
Document number: DS30506 Rev. 17 - 2  

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