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BZT52C3V6S PDF预览

BZT52C3V6S

更新时间: 2024-11-21 12:33:27
品牌 Logo 应用领域
TYSEMI /
页数 文件大小 规格书
2页 102K
描述
Planar Die Construction Ultra-Small Surface Mount Package

BZT52C3V6S 数据手册

 浏览型号BZT52C3V6S的Datasheet PDF文件第2页 
Product specification  
BZT52C2V0S - BZT52C39S  
Features  
Planar Die Construction  
Ultra-Small Surface Mount Package  
Ideally Suited for Automated Assembly Processes  
Absolute Maximum Ratings (Ta = 25  
)
Parameter  
Power dissipation  
Symbol  
P
Rating  
200  
Unit  
mW  
/W  
Thermal Resistance, Junction to Ambient Air  
R
JA  
625  
Forward Voltage  
@ IF = 10mA  
VF  
0.9  
V
Jumction temperature  
Storage temperature  
Tj  
150  
Tstg  
-65 to +150  
http://www.twtysemi.com  
sales@twtysemi.com  
4008-318-123  
1 of 2  

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