Datasheet > BZT52C3V3T

BZT52C3V3T

更新时间： 2024-11-13 12:33:27

品牌	Logo	应用领域
TYSEMI		/
页数	文件大小	规格书
2页	101K
描述
Planar Die Construction Ultra-Small Surface Mount Package

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中文翻译

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BZT52C3V3T 数据手册

Product specification

BZT52C2V0T - BZT52C39T

Features

Planar Die Construction

Ultra-Small Surface Mount Package

Ideally Suited for Automated Assembly Processes

Absolute Maximum Ratings (Ta = 25

)

Parameter

Power dissipation

Symbol

Rating

150

Unit

Thermal Resistance, Junction to Ambient Air

833

Forward Voltage

@ I^F= 10mA

V^F

0.9

Jumction temperature

Storage temperature

T^j

150

T^stg

-65 to +150

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4008-318-123

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BZT52C3V3-T	RECTRON	获取价格	Zener Diode,
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BZT52-C3V3-T3	WTE	获取价格	Zener Diode, 3.3V V(Z), 5%, 0.41W
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