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BZT52C3V3-TP PDF预览

BZT52C3V3-TP

更新时间: 2024-11-13 11:55:27
品牌 Logo 应用领域
美微科 - MCC 稳压二极管齐纳二极管测试光电二极管PC
页数 文件大小 规格书
3页 200K
描述
500 mW Zener Diode 2.4 to 43 Volts

BZT52C3V3-TP 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active包装说明:R-PDSO-G2
针数:2Reach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8541.10.00.50
风险等级:0.64Samacsys Confidence:4
Samacsys Status:ReleasedSamacsys PartID:698233
Samacsys Pin Count:2Samacsys Part Category:Zener Diode
Samacsys Package Category:Small Outline DiodeSamacsys Footprint Name:SOD-123_
Samacsys Released Date:2017-12-21 16:51:59Is Samacsys:N
配置:SINGLE二极管元件材料:SILICON
二极管类型:ZENER DIODE最大动态阻抗:95 Ω
JESD-30 代码:R-PDSO-G2JESD-609代码:e3
湿度敏感等级:1元件数量:1
端子数量:2最高工作温度:150 °C
最低工作温度:-65 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):260极性:UNIDIRECTIONAL
最大功率耗散:0.5 W认证状态:Not Qualified
标称参考电压:3.3 V子类别:Voltage Reference Diodes
表面贴装:YES技术:ZENER
端子面层:Matte Tin (Sn)端子形式:GULL WING
端子位置:DUAL处于峰值回流温度下的最长时间:10
最大电压容差:6.06%工作测试电流:5 mA
Base Number Matches:1

BZT52C3V3-TP 数据手册

 浏览型号BZT52C3V3-TP的Datasheet PDF文件第2页浏览型号BZT52C3V3-TP的Datasheet PDF文件第3页 
M C C  
Micro Commercial Components  
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20736 Marilla Street Chatsworth  
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ꢏꢐꢄꢑꢈꢒꢅꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢎ  
$ꢉ%ꢒꢅ   ꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢌ  
BZT52C2V4  
THRU  
BZT52C43  
TM  
Features  
xꢀ Planar Die Construction  
xꢀ 500mW Power Dissipation on Ceramic PCB  
xꢀ General Purpose Medium Current  
xꢀ Ideally Suited for Automated Assembly Processes  
500 mW  
Zener Diode  
2.4 to 43 Volts  
x
Case Material: Molded Plastic. UL Flammability  
Classification Rating 94V-0 and MSL Rating 1  
Lead Free Finish/RoHS Compliant("P" Suffix  
designates RoHS Compliant. See ordering information)  
SOD123  
A
B
Absolute Maximum Ratings  
Symbol  
Rating  
Rating  
500  
Unit  
mW  
к
C
E
PD  
Power dissipation  
TJ  
Junction Temperature  
-65 to +150  
-65 to +150  
к
TSTG  
Storage Temperature Range  
H
D
J
G
Absolute Maximum Ratings  
Symbol  
DIMENSIONS  
DIM  
INCHES  
MIN  
MM  
NOTE  
Rating  
Rating  
Unit  
MAX  
.152  
.112  
.071  
.053  
.031  
-----  
.01  
MIN  
3.55  
2.55  
1.40  
-----  
0.30  
0.15  
-----  
-----  
MAX  
3.85  
2.85  
1.80  
1.35  
.78  
Thermal Resistance Junction to  
Ambient*  
A
B
C
D
E
G
H
J
.140  
.100  
.055  
-----  
.012  
.006  
-----  
-----  
к/W  
RthJA  
250  
* Device mounted on ceramic PCB: 7.6mm x 9.4mm x 0.87mm with  
pad areas 25 mm2  
-----  
.25  
Electrical Characteristics  
.006  
.15  
Symbol  
Rating  
Rating  
Unit  
SUGGESTED SOLDER  
PAD LAYOUT  
Maximum Forward Voltage  
(IF=10mAdc)  
VF  
0.9  
V
0.093"  
0.048”  
0.036”  
www.mccsemi.com  
1 of 3  
Revision: 10  
2010/03/01  

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