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BZT52C27T-TP-HF PDF预览

BZT52C27T-TP-HF

更新时间: 2024-11-10 12:59:35
品牌 Logo 应用领域
美微科 - MCC 稳压二极管
页数 文件大小 规格书
3页 200K
描述
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BZT52C27T-TP-HF 数据手册

 浏览型号BZT52C27T-TP-HF的Datasheet PDF文件第2页浏览型号BZT52C27T-TP-HF的Datasheet PDF文件第3页 
M C C  
Micro Commercial Components  
ꢀꢁꢂꢃꢄꢅꢆꢄꢇꢇꢈꢃꢂꢁꢉꢊꢅꢆomponents  
20736 Marilla Street Chatsworth  
ꢆꢋꢅꢌꢍꢎꢍꢍ  
ꢏꢐꢄꢑꢈꢒꢅꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢎ  
$ꢉ%ꢒꢅ   ꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢌ  
BZT52C2V4  
THRU  
BZT52C43  
TM  
Features  
xꢀ Planar Die Construction  
xꢀ 500mW Power Dissipation on Ceramic PCB  
xꢀ General Purpose Medium Current  
xꢀ Ideally Suited for Automated Assembly Processes  
500 mW  
Zener Diode  
2.4 to 43 Volts  
x
Case Material: Molded Plastic. UL Flammability  
Classification Rating 94V-0 and MSL Rating 1  
Lead Free Finish/RoHS Compliant("P" Suffix  
designates RoHS Compliant. See ordering information)  
SOD123  
A
B
Absolute Maximum Ratings  
Symbol  
Rating  
Rating  
500  
Unit  
mW  
к
C
E
PD  
Power dissipation  
TJ  
Junction Temperature  
-65 to +150  
-65 to +150  
к
TSTG  
Storage Temperature Range  
H
D
J
G
Absolute Maximum Ratings  
Symbol  
DIMENSIONS  
DIM  
INCHES  
MIN  
MM  
NOTE  
Rating  
Rating  
Unit  
MAX  
.152  
.112  
.071  
.053  
.031  
-----  
.01  
MIN  
3.55  
2.55  
1.40  
-----  
0.30  
0.15  
-----  
-----  
MAX  
3.85  
2.85  
1.80  
1.35  
.78  
Thermal Resistance Junction to  
Ambient*  
A
B
C
D
E
G
H
J
.140  
.100  
.055  
-----  
.012  
.006  
-----  
-----  
к/W  
RthJA  
250  
* Device mounted on ceramic PCB: 7.6mm x 9.4mm x 0.87mm with  
pad areas 25 mm2  
-----  
.25  
Electrical Characteristics  
.006  
.15  
Symbol  
Rating  
Rating  
Unit  
SUGGESTED SOLDER  
PAD LAYOUT  
Maximum Forward Voltage  
(IF=10mAdc)  
VF  
0.9  
V
0.093"  
0.048”  
0.036”  
www.mccsemi.com  
1 of 3  
Revision: 10  
2010/03/01  

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