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BZT52C24LS PDF预览

BZT52C24LS

更新时间: 2024-11-14 00:38:55
品牌 Logo 应用领域
美微科 - MCC /
页数 文件大小 规格书
4页 341K
描述
200 mW Zener Diode 2.4 to 39 Volts

BZT52C24LS 数据手册

 浏览型号BZT52C24LS的Datasheet PDF文件第2页浏览型号BZT52C24LS的Datasheet PDF文件第3页浏览型号BZT52C24LS的Datasheet PDF文件第4页 
M C C  
R
Micro Commercial Components  
BZT52C2V4LS  
THRU  
BZT52C39LS  
ꢀꢁꢂꢃꢄꢅꢆꢄꢇꢇꢈꢃꢂꢁꢉꢊꢅꢆomponents  
20736 Marilla Street Chatsworth  
ꢆꢋꢅꢌꢍꢎꢍꢍ  
ꢏꢐꢄꢑꢈꢒꢅꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢎ  
$ꢉ%ꢒꢅ   ꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢌ  
Features  
xꢀ Planar Die Construction  
200 mW  
Zener Diode  
2.4 to 39 Volts  
xꢀ 200mW Power Dissipation on Ceramic PCB  
xꢀ General Purpose Medium Current  
xꢀ Ideally Suited for Automated Assembly Processes  
·
Epoxy meets UL 94 V-0 flammability rating  
·
Moisture Sensitivity Level 1  
Lead Free Finish/RoHS Compliant("P" Suffix  
designates RoHS Compliant. See ordering information)  
Halogen free available upon request by adding suffix "-HF"  
SOD-323  
A
B
Absolute Maximum Ratings  
Symbol  
Parameter  
Rating  
200  
Unit  
mW  
к
C
E
PD  
Power dissipation  
TJ  
Junction Temperature  
-65 to +150  
-65 to +150  
к
TSTG  
Storage Temperature Range  
H
D
G
Absolute Maximum Ratings  
DIMENSIONS  
Symbol  
Parameter  
Rating  
Unit  
DIM  
INCHES  
MIN  
MM  
NOTE  
Thermal Resistance Junction to  
Ambient*  
к/W  
RthJA  
625  
MAX  
.107  
.078  
.053  
.038  
.014  
---  
MIN  
2.30  
1.75  
1.15  
0.70  
0.25  
0.30  
0.05  
MAX  
2.70  
1.95  
1.35  
0.95  
0.35  
---  
A
B
C
D
E
G
H
.090  
.068  
.045  
.027  
.010  
.012  
.002  
* Device mounted on ceramic PCB: 7.6mm x 9.4mm x 0.87mm with  
pad areas 25 mm2  
Electrical Characteristics  
.006  
0.15  
Symbol  
Parameter  
Rating  
Unit  
SUGGESTED SOLDER  
PAD LAYOUT  
Maximum Forward Voltage  
(IF=10mAdc)  
0.069  
VF  
0.9  
V
0.032”  
0.022”  
www.mccsemi.com  
1 of 4  
2017/03/07  
Revision: B  

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