RECTRON
TECHNICAL SPECIFICATION
BZT52C2V4-
BZT52C39
SEMICONDUCTOR
SURFACE MOUNT ZENER DIODE
VOLTAGE RANGE 2.4 to 39 Volts POWER RATING 500 mWatts
FEATURES
* Planar Die Construction
500mW Power Dissipation on Ceramic PCB
General Purpose Medium Current
Ideally Suited for Automated Assembly Processes
*
*
*
SOD-123
MECHANICAL DATA
* Case: Molded plastic
.110(2.80)
.102(2.60)
* Epoxy: UL 94V-O rate flame retardant
* Lead: MIL-STD-202E method 208C guaranteed
* Mounting position: Any
.067(1.70)
.059(1.50)
* Weight: 0.01 gram
.152(3.85)
.140(3.55)
.049(1.25)
.041(1.05)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25 oC ambient temperature unless otherwise specified.
.004(.10)
.000(.00)
REF .020(0.50)
Dimensions in inches and (millimeters)
MAXIMUM RATINGES ( @ TA = 25oC unless otherwise noted )
RATINGS
SYMBOL
PD
VALUE
500
UNITS
o
Max. Steady State Power Dissipation @TA=25 C (Note 1)
Max. Operating Temperature Range
mW
oC
-65 to +150
-65 to +150
TJ
Storage Temperature Range
TSTG
oC
ELECTRICAL CHARACTERISTICS ( @ TA = 25oC unless otherwise noted )
CHARACTERISTICS
SYMBOL
MIN.
TYP.
MAX.
305
UNITS
oC/W
Volts
Thermal Resistance Junction to Ambient (Note 1)
Max. Instantaneous Forward Voltage at IF= 10mA
R θJA
-
-
-
-
VF
0.9
2
Note 1. Device mounted on ceramic PCB; 7.6mm x 9.4mm x 0.87mm with pad areas 25mm .
2006-3