BZD17C3V6P to BZD17C200P
Vishay Semiconductors
Zener Diodes
Features
• Sillicon planar zener diodes
• Low profile surface-mount package
• Low leakage current
• Excellent stability
• High temperature soldering: 260 °C/10 s
at terminals
• Compliant to RoHS directive 2002/95/EC and in
accordance to WEEE 2002/96/EC
17249
Packaging codes/options:
GS18/10K per 13" reel, (8 mm tape), 50K/box
GS08/3K per 7" reel, (8 mm tape), 30K/box
Mechanical Data
Case: JEDEC DO219AB (SMF ) plastic case
Weight: approx. 15 mg
®
Absolute Maximum Ratings
T
= 25 °C, unless otherwise specified
amb
Parameter
Test condition
TL = 80 °C
Symbol
Ptot
Value
2.3
Unit
W
Power dissipation
0.8 1)
TA = 25 °C
Ptot
W
Non-repetitive peak pulse power
dissipation
100 µs square pulse 2)
PZSM
300
W
Notes:
1) Mounted on epoxy-glass PCB with 3 mm x 3 mm Cu pads (≥ 40 µm thick)
2) Tj = 25 °C prior to surge
Thermal Characteristics
T
= 25 °C, unless otherwise specified
amb
Parameter
Test condition
Symbol
RthJA
RthJL
Tj
Value
180
Unit
K/W
K/W
°C
1)
Thermal resistance junction to ambient air
Thermal resistance junction to lead
Maximum junction temperature
Storage temperature range
30
150
Tstg
- 55 to + 150
°C
Notes:
1) Mounted on epoxy-glass PCB with 3 mm x 3 mm Cu pads (≥ 40 µm thick)
Electrical Characteristics
T
= 25 °C, unless otherwise specified
amb
Parameter
Test condition
Symbol
VF
Min.
Typ.
Max.
1.2
Unit
V
IF = 0.2 A
Forward voltage
Document Number 81821
Rev. 1.0, 09-Jun-09
www.vishay.com
1
For technical support, please contact: Diodes-SSP@vishay.com