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BZD17C11P PDF预览

BZD17C11P

更新时间: 2024-11-12 02:59:07
品牌 Logo 应用领域
威世 - VISHAY 测试光电二极管
页数 文件大小 规格书
5页 85K
描述
Excellent stability

BZD17C11P 数据手册

 浏览型号BZD17C11P的Datasheet PDF文件第2页浏览型号BZD17C11P的Datasheet PDF文件第3页浏览型号BZD17C11P的Datasheet PDF文件第4页浏览型号BZD17C11P的Datasheet PDF文件第5页 
BZD17C3V6P to BZD17C200P  
Vishay Semiconductors  
Zener Diodes  
Features  
• Sillicon planar zener diodes  
• Low profile surface-mount package  
• Low leakage current  
• Excellent stability  
• High temperature soldering: 260 °C/10 s  
at terminals  
• Compliant to RoHS directive 2002/95/EC and in  
accordance to WEEE 2002/96/EC  
17249  
Packaging codes/options:  
GS18/10K per 13" reel, (8 mm tape), 50K/box  
GS08/3K per 7" reel, (8 mm tape), 30K/box  
Mechanical Data  
Case: JEDEC DO219AB (SMF ) plastic case  
Weight: approx. 15 mg  
®
Absolute Maximum Ratings  
T
= 25 °C, unless otherwise specified  
amb  
Parameter  
Test condition  
TL = 80 °C  
Symbol  
Ptot  
Value  
2.3  
Unit  
W
Power dissipation  
0.8 1)  
TA = 25 °C  
Ptot  
W
Non-repetitive peak pulse power  
dissipation  
100 µs square pulse 2)  
PZSM  
300  
W
Notes:  
1) Mounted on epoxy-glass PCB with 3 mm x 3 mm Cu pads (40 µm thick)  
2) Tj = 25 °C prior to surge  
Thermal Characteristics  
T
= 25 °C, unless otherwise specified  
amb  
Parameter  
Test condition  
Symbol  
RthJA  
RthJL  
Tj  
Value  
180  
Unit  
K/W  
K/W  
°C  
1)  
Thermal resistance junction to ambient air  
Thermal resistance junction to lead  
Maximum junction temperature  
Storage temperature range  
30  
150  
Tstg  
- 55 to + 150  
°C  
Notes:  
1) Mounted on epoxy-glass PCB with 3 mm x 3 mm Cu pads (40 µm thick)  
Electrical Characteristics  
T
= 25 °C, unless otherwise specified  
amb  
Parameter  
Test condition  
Symbol  
VF  
Min.  
Typ.  
Max.  
1.2  
Unit  
V
IF = 0.2 A  
Forward voltage  
Document Number 81821  
Rev. 1.0, 09-Jun-09  
www.vishay.com  
1
For technical support, please contact: Diodes-SSP@vishay.com  

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