5秒后页面跳转
捷配首页

Datasheet > 放大器电路 > 缓冲放大器> BUF634T
BUF634T PDF预览

BUF634T

更新时间： 2024-01-20 20:27:17
品牌 Logo 应用领域
BB 缓冲放大器放大器电路局域网
页数 文件大小 规格书
11页 200K
描述
250mA HIGH-SPEED BUFFER

阅读下载

中文翻译

获取价格

BUF634T 技术参数

生命周期：TransferredReach Compliance Code：unknown
风险等级：5.56Is Samacsys：N
放大器类型：BUFFER最大平均偏置电流 (IIB)：2 µA
标称带宽 (3dB)：180 MHz最大输入失调电压：100000 µV
JESD-30 代码：R-PDSO-G8负供电电压上限：-18 V
标称负供电电压 (Vsup)：-15 V功能数量：1
端子数量：8最高工作温度：85 °C
最低工作温度：-40 °C封装主体材料：PLASTIC/EPOXY
封装代码：SOP封装形状：RECTANGULAR
封装形式：SMALL OUTLINE认证状态：Not Qualified
标称压摆率：2000 V/us供电电压上限：18 V
标称供电电压 (Vsup)：15 V表面贴装：YES
温度等级：INDUSTRIAL端子形式：GULL WING
端子位置：DUALBase Number Matches：1

BUF634T 数据手册

 浏览型号BUF634T的Datasheet PDF文件第5页浏览型号BUF634T的Datasheet PDF文件第6页浏览型号BUF634T的Datasheet PDF文件第7页浏览型号BUF634T的Datasheet PDF文件第8页浏览型号BUF634T的Datasheet PDF文件第9页浏览型号BUF634T的Datasheet PDF文件第11页 
PACKAGE OPTION ADDENDUM  
www.ti.com  
25-Oct-2005  
PACKAGING INFORMATION  
Orderable Device  
BUF634F  
Status (1)  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
OBSOLETE DDPAK/  
TO-263  
KTT  
5
5
5
TBD  
TBD  
TBD  
TBD  
Call TI  
Call TI  
BUF634F/500  
BUF634FKTTT  
ACTIVE  
DDPAK/  
TO-263  
KTT  
KTT  
500  
50  
CU SNPB  
CU SNPB  
CU SNPB  
Level-3-220C-168 HR  
Level-3-220C-168 HR  
Level-NA-NA-NA  
ACTIVE  
DDPAK/  
TO-263  
BUF634P  
BUF634T  
ACTIVE  
ACTIVE  
PDIP  
P
8
5
50  
TO-220  
KC  
49 Green (RoHS & TAMAC2-1/2H Level-NC-NC-NC  
no Sb/Br)  
SN  
BUF634U  
ACTIVE  
ACTIVE  
SOIC  
SOIC  
D
D
8
8
100  
TBD  
CU NIPDAU Level-3-220C-168 HR  
CU NIPDAU Level-3-220C-168 HR  
BUF634U/2K5  
2500  
TBD  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan  
-
The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS  
&
no Sb/Br)  
-
please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 1  
1...7891011

中文翻译

下载PDF

与BUF634T相关器件

型号 品牌 描述 获取价格 数据表
BUF634TG3 BB 250mA HIGH-SPEED BUFFER

获取价格
BUF634U BB 250mA HIGH-SPEED BUFFER

获取价格
BUF634U/2K5 BB 250mA HIGH-SPEED BUFFER

获取价格
BUF634U/2K5E4 BB 250mA HIGH-SPEED BUFFER

获取价格
BUF634U-2K5 BB 250mA HIGH-SPEED BUFFER

获取价格
BUF634U-2K5E4 BB 250mA HIGH-SPEED BUFFER

获取价格
BUF634UE4 BB 250mA HIGH-SPEED BUFFER

获取价格
BUF634U-TR BB Buffer Amplifier, 1 Func, PDSO8,

获取价格
BUF636A TEMIC Silicon NPN High Voltage Switching Transistor

获取价格
BUF640 VISHAY Transistor,

获取价格

与BUF634T相关文章

您还可以找


热门产品
PCB打样/小批量
铝基板
BOM智能配单
PCBA制造
钣金
精密CNC
模具注塑
薄膜开关
精选活动
PCBA打样特惠
四六层板品质升级
铝基板品质升级
一体化电子制造
DFM下载
服务支持
企业认证
产品展示
工厂展示
工艺能力
积分商城
关于捷配
捷配简介
企业文化
公司动态
人才招聘
联系我们
帮助中心
下单流程
付款流程
开票流程
常见问题
全球PCB制造服务专线 400-613-0088

工作时间：9:00-21:00

CEO邮箱：ceo@jiepei.com

投诉邮箱：tousu@jiepei.com

捷配网-微信公众号 微信公众号
捷配网-微信公众号 抖音公众号
资质认证：
合作快递：
支付方式：
Copyright © 2024 Jiepei.com Inc. All Rights Reserved. 版权所有:杭州捷配信息科技有限公司 浙公网安备 33010502006866号 浙ICP备10014259号-119 营业执照ICP证