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BUF634AIDDAR PDF预览

BUF634AIDDAR

更新时间: 2022-06-24 15:42:59
品牌 Logo 应用领域
德州仪器 - TI /
页数 文件大小 规格书
41页 3585K
描述
BUF634A 36-V, 210-MHz, 250-mA Output, High-Speed Buffer

BUF634AIDDAR 数据手册

 浏览型号BUF634AIDDAR的Datasheet PDF文件第35页浏览型号BUF634AIDDAR的Datasheet PDF文件第36页浏览型号BUF634AIDDAR的Datasheet PDF文件第37页浏览型号BUF634AIDDAR的Datasheet PDF文件第39页浏览型号BUF634AIDDAR的Datasheet PDF文件第40页浏览型号BUF634AIDDAR的Datasheet PDF文件第41页 
EXAMPLE BOARD LAYOUT  
D0008A  
SOIC - 1.75 mm max height  
SMALL OUTLINE INTEGRATED CIRCUIT  
8X (.061 )  
[1.55]  
SYMM  
SEE  
DETAILS  
1
8
8X (.024)  
[0.6]  
SYMM  
(R.002 ) TYP  
[0.05]  
5
4
6X (.050 )  
[1.27]  
(.213)  
[5.4]  
LAND PATTERN EXAMPLE  
EXPOSED METAL SHOWN  
SCALE:8X  
SOLDER MASK  
OPENING  
SOLDER MASK  
OPENING  
METAL UNDER  
SOLDER MASK  
METAL  
EXPOSED  
METAL  
EXPOSED  
METAL  
.0028 MAX  
[0.07]  
.0028 MIN  
[0.07]  
ALL AROUND  
ALL AROUND  
SOLDER MASK  
DEFINED  
NON SOLDER MASK  
DEFINED  
SOLDER MASK DETAILS  
4214825/C 02/2019  
NOTES: (continued)  
6. Publication IPC-7351 may have alternate designs.  
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.  
www.ti.com  

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