Datasheet > BUF634AIDDAR

BUF634AIDDAR

更新时间： 2022-06-24 15:42:59

品牌	Logo	应用领域
德州仪器 - TI		/
页数	文件大小	规格书
41页	3585K
描述
BUF634A 36-V, 210-MHz, 250-mA Output, High-Speed Buffer

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BUF634AIDDAR 数据手册

EXAMPLE STENCIL DESIGN

DDA0008J

PowerPAD^TMSOIC - 1.7 mm max height

PLASTIC SMALL OUTLINE

(2.6)

BASED ON

0.125 THICK

STENCIL

8X (1.55)

8X (0.6)

(3.1)

SYMM

BASED ON

0.127 THICK

STENCIL

6X (1.27)

SEE TABLE FOR

METAL COVERED

BY SOLDER MASK

SYMM

(5.4)

DIFFERENT OPENINGS

FOR OTHER STENCIL

THICKNESSES

SOLDER PASTE EXAMPLE

EXPOSED PAD

100% PRINTED SOLDER COVERAGE BY AREA

SCALE:10X

STENCIL

THICKNESS

SOLDER STENCIL

OPENING

0.1

2.91 X 3.47

2.6 X 3.1 (SHOWN)

2.37 X 2.83

0.125

0.150

0.175

2.20 X 2.62

4221637/B 03/2016

NOTES: (continued)

10. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

11. Board assembly site may have different recommendations for stencil design.

www.ti.com

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与BUF634AIDDAR相关器件

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BUF634AIDRBR	TI	BUF634A 36-V, 210-MHz, 250-mA Output, High-Speed Buffer	获取价格
BUF634F	BB	250mA HIGH-SPEED BUFFER	获取价格
BUF634F/500	BB	250mA HIGH-SPEED BUFFER	获取价格
BUF634F/500E3	BB	250mA HIGH-SPEED BUFFER	获取价格
BUF634F-500	BB	250mA HIGH-SPEED BUFFER	获取价格