Datasheet > BUF634AIDDAR

BUF634AIDDAR

更新时间： 2022-06-24 15:42:59

品牌	Logo	应用领域
德州仪器 - TI		/
页数	文件大小	规格书
41页	3585K
描述
BUF634A 36-V, 210-MHz, 250-mA Output, High-Speed Buffer

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BUF634AIDDAR 数据手册

EXAMPLE STENCIL DESIGN

D0008A

SOIC - 1.75 mm max height

SMALL OUTLINE INTEGRATED CIRCUIT

8X (.061 )

[1.55]

SYMM

8X (.024)

[0.6]

SYMM

(R.002 ) TYP

[0.05]

6X (.050 )

[1.27]

(.213)

[5.4]

SOLDER PASTE EXAMPLE

BASED ON .005 INCH [0.125 MM] THICK STENCIL

SCALE:8X

4214825/C 02/2019

NOTES: (continued)

8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

9. Board assembly site may have different recommendations for stencil design.

www.ti.com

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型号	品牌	描述	获取价格	数据表
BUF634AIDR	TI	210MHz、250mA 高速缓冲器 \| D \| 8 \| -40 to 125	获取价格
BUF634AIDRBR	TI	BUF634A 36-V, 210-MHz, 250-mA Output, High-Speed Buffer	获取价格
BUF634F	BB	250mA HIGH-SPEED BUFFER	获取价格
BUF634F/500	BB	250mA HIGH-SPEED BUFFER	获取价格
BUF634F/500E3	BB	250mA HIGH-SPEED BUFFER	获取价格
BUF634F-500	BB	250mA HIGH-SPEED BUFFER	获取价格