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BS616LV8016FI55 PDF预览

BS616LV8016FI55

更新时间: 2024-10-03 03:05:59
品牌 Logo 应用领域
BSI 存储内存集成电路静态存储器
页数 文件大小 规格书
10页 155K
描述
Very Low Power CMOS SRAM 512K X 16 bit

BS616LV8016FI55 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
包装说明:FBGA, BGA48,6X8,30Reach Compliance Code:unknown
风险等级:5.92Is Samacsys:N
最长访问时间:55 nsI/O 类型:COMMON
JESD-30 代码:R-PBGA-B48JESD-609代码:e0
内存密度:8388608 bit内存集成电路类型:STANDARD SRAM
内存宽度:16湿度敏感等级:3
端子数量:48字数:524288 words
字数代码:512000工作模式:ASYNCHRONOUS
最高工作温度:85 °C最低工作温度:-40 °C
组织:512KX16输出特性:3-STATE
封装主体材料:PLASTIC/EPOXY封装代码:FBGA
封装等效代码:BGA48,6X8,30封装形状:RECTANGULAR
封装形式:GRID ARRAY, FINE PITCH并行/串行:PARALLEL
电源:3/5 V认证状态:Not Qualified
最大待机电流:0.0000025 A最小待机电流:1.5 V
子类别:SRAMs最大压摆率:0.076 mA
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子面层:Tin/Lead (Sn/Pb)
端子形式:BALL端子节距:0.75 mm
端子位置:BOTTOMBase Number Matches:1

BS616LV8016FI55 数据手册

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Very Low Power CMOS SRAM  
512K X 16 bit  
BS616LV8016  
Pb-Free and Green package materials are compliant to RoHS  
n FEATURES  
ŸWide VCC operation voltage : 2.4V ~ 5.5V  
n DESCRIPTION  
The BS616LV8016 is a high performance, very low power CMOS  
Static Random Access Memory organized as 524,288 by 16 bits and  
operates form a wide range of 2.4V to 5.5V supply voltage.  
Advanced CMOS technology and circuit techniques provide both  
high speed and low power features with typical CMOS standby  
current of 0.8uA at 3.0V/25OC and maximum access time of 55ns at  
3.0V/85OC.  
ŸVery low power consumption :  
VCC = 3.0V  
VCC = 5.0V  
Operation current : 31mA (Max.) at 55ns  
2mA (Max.) at 1MHz  
Standby current : 0.8uA (Typ.) at 25OC  
Operation current : 76mA (Max.) at 55ns  
10mA (Max.) at 1MHz  
Standby current : 3.5uA (Typ.) at 25OC  
ŸHigh speed access time :  
Easy memory expansion is provided by an active LOW chip enable  
(CE1), active HIGH chip enable (CE2) and active LOW output  
enable (OE) and three-state output drivers.  
-55  
-70  
55ns(Max.) at VCC=3.0~5.5V  
70ns(Max.) at VCC=2.7~5.5V  
ŸAutomatic power down when chip is deselected  
ŸEasy expansion with CE2, CE1 and OE options  
ŸI/O Configuration x8/x16 selectable by LB and UB pin.  
ŸThree state outputs and TTL compatible  
The BS616LV8016 has an automatic power down feature, reducing  
the power consumption significantly when chip is deselected.  
The BS616LV8016 is available in DICE form and 48-ball BGA  
package.  
ŸFully static operation, no clock, no refresh  
ŸData retention supply voltage as low as 1.5V  
n POWER CONSUMPTION  
POWER DISSIPATION  
Operating  
STANDBY  
PRODUCT  
FAMILY  
OPERATING  
TEMPERATURE  
PKG TYPE  
(ICCSB1, Max)  
(ICC, Max)  
VCC=5.0V  
10MHz  
VCC=3.0V  
10MHz  
VCC=5.0V VCC=3.0V  
1MHz  
9mA  
fMax.  
1MHz  
fMax.  
BS616LV8016DC  
BS616LV8016FC  
DICE  
Commercial  
25uA  
50uA  
4.0uA  
8.0uA  
39mA  
40mA  
75mA  
1.5mA  
19mA  
20mA  
30mA  
+0OC to +70OC  
BGA-48-0912  
Industrial  
BS616LV8016FI  
10mA  
76mA  
2mA  
31mA  
BGA-48-0912  
-40OC to +85OC  
n PIN CONFIGURATIONS  
n BLOCK DIAGRAM  
1
2
3
4
5
6
A13  
A12  
A11  
A
B
C
D
E
F
LB  
OE  
A0  
A1  
A2  
CE2  
DQ0  
DQ2  
VCC  
VSS  
DQ6  
DQ7  
NC  
A10  
A9  
A8  
A7  
A6  
A5  
A4  
Address  
Input  
1024  
Memory Array  
10  
Row  
Decoder  
Buffer  
1024 x 8192  
DQ8  
DQ9  
VSS  
UB  
A3  
A5  
A4  
A6  
CE1  
DQ1  
DQ3  
DQ4  
DQ5  
WE  
DQ10  
DQ11  
8192  
DQ0  
Column I/O  
16  
16  
A17  
VSS  
A14  
A12  
A9  
A7  
Data  
Input  
Buffer  
.
.
.
.
.
.
.
.
Write Driver  
Sense Amp  
.
16  
16  
.
VCC DQ12  
DQ14 DQ13  
A16  
A15  
A13  
A10  
Data  
Output  
Buffer  
.
.
512  
Column Decoder  
DQ15  
9
CE2  
CE1  
WE  
OE  
UB  
G
H
DQ15  
A18  
NC  
A8  
Address Input Buffer  
Control  
A11  
LB  
A14 A15 A16 A17 A18 A0 A1 A2 A3  
VCC  
VSS  
48-ball BGA top view  
Brilliance Semiconductor, Inc. reserves the right to change products and specifications without notice.  
R0201-BS616LV8016  
Revision 2.3  
May. 2006  
1

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