Datasheet > BGU8006,115

BGU8006,115

更新时间： 2024-09-21 20:00:59

品牌	Logo	应用领域
恩智浦 - NXP		全球定位系统
页数	文件大小	规格书
19页	396K
描述
BGU8006 - SiGe:C Low Noise Amplifier MMIC for GPS, GLONASS, Galileo and Compass CSP 6-Pin

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BGU8006,115 技术参数

是否Rohs认证：	符合	生命周期：	Obsolete
零件包装代码：	CSP	针数：	6
Reach Compliance Code：	compliant	风险等级：	7.99
Base Number Matches：	1

BGU8006,115 数据手册

BGU8006

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SiGe:C Low Noise Amplifier MMIC for GPS, GLONASS, Galileo

and Compass

Rev. 2 — 12 December 2012

Product data sheet

1. Product profile

1.1 General description

The BGU8006 is a Low Noise Amplifier (LNA) for GNSS receiver applications. It comes as

extremely small and thin Wafer Level Chip Scale Package (WLCSP). The BGU8006

requires one external matching inductor and one external decoupling capacitor.

The BGU8006 adapts itself to the changing environment resulting from co-habitation of

different radio systems in modern cellular handsets. It has been designed for low power

consumption and optimal performance when jamming signals from co-existing cellular

transmitters are present. At low jamming power levels it delivers 17.2 dB gain at a noise

figure of 0.60 dB. During high jamming power levels, resulting for example from a cellular

transmit burst, it temporarily increases its bias current to improve sensitivity.

CAUTION

This device is sensitive to ElectroStatic Discharge (ESD). Therefore care should be taken

during transport and handling.

1.2 Features and benefits

 Covers full GNSS L1 band, from 1559 MHz to 1610 MHz

 Noise figure (NF) = 0.60 dB

 Gain 17.2 dB

 High input 1 dB compression point of 7.5 dBm

 High out of band IP3_iof 6 dBm

 Supply voltage 1.5 V to 3.1 V

 Optimized performance at very low 3.6 mA supply current

 Power-down mode current consumption < 1 A

 Integrated temperature stabilized bias for easy design

 Requires only one input matching inductor and one supply decoupling capacitor

 Input and output DC decoupled

 ESD protection on all pins (HBM > 2 kV)

 Integrated matching for the output

 Extremely small Wafer Level Chip Scale Package (WLCSP) 0.65  0.44  0.2 mm;

6 solder bumps; 0.22 mm bump pitch

 180 GHz transit frequency - SiGe:C technology

12 3 4 5 6 7...19

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