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BDX33B_06 PDF预览

BDX33B_06

更新时间: 2024-11-29 03:21:39
品牌 Logo 应用领域
安森美 - ONSEMI 晶体晶体管
页数 文件大小 规格书
6页 74K
描述
Darlington Complementary Silicon Power Transistors

BDX33B_06 数据手册

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BDX33B, BDX33C* (NPN)  
BDX34B, BDX34C* (PNP)  
BDX33C and BDX34C are Preferred Devices  
Darlington Complementary  
Silicon Power Transistors  
These devices are designed for general purpose and low speed  
switching applications.  
http://onsemi.com  
Features  
DARLINGTON  
10 AMPERE  
COMPLEMENTARY SILICON  
POWER TRANSISTORS  
80−100 VOLTS, 65 WATTS  
High DC Current Gain − h = 2500 (typ.) at I = 4.0  
FE  
C
Collector−Emitter Sustaining Voltage at 100 mAdc  
V
= 80 Vdc (min) − BDX33B, BDX334B  
= 100 Vdc (min) − BDX33C, BDX334C  
CEO(sus)  
Low Collector−Emitter Saturation Voltage  
V
= 2.5 Vdc (max) at I = 3.0 Adc  
CE(sat)  
C
− BDX33B, 33C/34B, 34C  
Monolithic Construction with Build−In Base−Emitter Shunt Resistors  
Pb−Free Packages are Available*  
MAXIMUM RATINGS  
TO−220AB  
Rating  
Symbol  
Value  
Unit  
CASE 221A−09  
Collector−Emitter Voltage  
V
Vdc  
CEO  
1
STYLE 1  
BDX33B, BDX34B  
BDX33C, BDX34C  
80  
100  
2
3
Collector−Base Voltage  
V
Vdc  
CB  
EB  
BDX33B, BDX34B  
BDX33C, BDX34C  
80  
100  
MARKING DIAGRAM  
Emitter−Base Voltage  
V
5.0  
Vdc  
Adc  
Collector Current − Continuous  
− Peak  
I
10  
15  
C
Base Current  
I
0.25  
Adc  
B
BDX3xyG  
AY WW  
Total Device Dissipation @ T = 25_C  
P
70  
0.56  
W
W/_C  
_C  
C
D
Derate above 25°C  
Operating and Storage Junction  
Temperature Range  
T , T  
J
−65 to +150  
stg  
THERMAL CHARACTERISTICS  
Characteristics  
Symbol  
Max  
Unit  
Thermal Resistance, Junction−to−Case  
R
1.78  
_C/W  
q
JC  
BDX3xy = Device Code  
x = 3 or 4  
Maximum ratings are those values beyond which device damage can occur.  
Maximum ratings applied to the device are individual stress limit values (not  
normal operating conditions) and are not valid simultaneously. If these limits are  
exceeded, device functional operation is not implied, damage may occur and  
reliability may be affected.  
y = B or C  
A
= Assembly Location  
Y
= Year  
WW  
G
= Work Week  
= Pb−Free Package  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 5 of this data sheet.  
*For additional information on our Pb−Free strategy and soldering details, please  
download the ON Semiconductor Soldering and Mounting Techniques  
Reference Manual, SOLDERRM/D.  
Preferred devices are recommended choices for future use  
and best overall value.  
©
Semiconductor Components Industries, LLC, 2006  
1
Publication Order Number:  
February, 2006 − Rev. 11  
BDX33B/D  

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