Datasheet > BD7LS17G-C

BD7LS17G-C

更新时间： 2023-09-03 20:35:17

品牌	Logo	应用领域
罗姆 - ROHM		/
页数	文件大小	规格书
13页	1390K
描述
BD7LS17G-C是适用于车载应用的Single Schmitt Trigger Buffer。可保证在1.65V到5.5V的电源电压下工作。具备output tolerant电路，可在断电时防止电流从连接对象流入，保护输出电路。

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BD7LS17G-C 数据手册

BD7LS17G-C

Absolute Maximum Ratings (Ta = 25 °C)

Parameter

Symbol

Rating

Unit

Supply Voltage Range

V_CC

V_IN

-0.5 to +6.5

-50

Input Voltage Range

Input Diode Current (V_IN< 0)

Output Diode Current (V_O< 0)

Output Current

I_IK

°C

I_OK

-50

I_O

±50

VCC-GND Current

I_CC

±50

Maximum Junction Temperature

Tjmax

+150

Storage Temperature Range

Tstg

-55 to +150

°C

Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open

circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in

case the IC is operated over the absolute maximum ratings.

Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration

of the properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into

consideration by increasing board size and copper area so as not to exceed the maximum junction temperature rating.

Thermal Resistance ^{(Note 1)}

Thermal Resistance (Typ)

Parameter

Symbol

Unit

1s^{(Note 3)}

2s2p^{(Note 4)}

SSOP5

Junction to Ambient

Junction to Top Characterization Parameter^{(Note 2)}

θ_JA

376.5

185.4

°C/W

Ψ_JT

Layer Number of

Material

Board Size

114.3 mm x 76.2 mm x 1.57 mmt

Measurement Board

Single

FR-4

Top

Copper Pattern

Thickness

70 μm

Footprints and Traces

Layer Number of

Measurement Board

4 Layers

Material

Board Size

FR-4

114.3 mm x 76.2 mm x 1.6 mmt

2 Internal Layers

Top

Copper Pattern

Bottom

Thickness

70 μm

Copper Pattern

Thickness

35 μm

Copper Pattern

74.2 mm x 74.2 mm

Thickness

70 μm

Footprints and Traces

(Note 1) Based on JESD51-2A (Still-Air).

74.2 mm x 74.2 mm

(Note 2) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the

outside surface of the component package.

(Note 3) Using a PCB board based on JESD51-3.

(Note 4) Using a PCB board based on JESD51-7.

Recommended Operating Conditions

Parameter

Symbol

Min

1.65

1.5

Typ

Max

5.5

Unit

Conditions

Operating

Supply Voltage

V_CC

5.5

Data Retention Only

Input Voltage

V_IN

V_O

5.5

Output Voltage

V_CC

Operating Temperature

Topr

-40

+125

°C

(Note) The recommended operating conditions are the range where operation is guaranteed. If this ranges are exceeded, operation is not guaranteed

even within the absolute maximum ratings. Unused inputs must be tied to either V_CCor GND.

www.rohm.com

TSZ22111 • 15 • 001

TSZ02201-0G4G0GZ00090-1-2

2/10

21.Apr.2020 Rev.001

123 4 5 6 7...13

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