Datasheet
Power Management LSI
for Mobile Phone
BD7185AGWL
General Description
Key Specifications
The BD7185AGWL is an integrated Power Management
LSI available in a small 80-pins 0.4mm-pitch 3.8mm-by-
3.8mm Wafer-level CSP package, which is designed to
meet demands for space-constrained Smart phones.
Input Voltage Range:
Output Voltage Range:
Switching Frequency:
OFF Current:
2.6V to 5.5V
1.0V to 3.4V
2.0MHz(Typ)
0.3μA (Typ)
Operating Temperature Range:
-35℃ to +85℃
The device provides 5-Buck Converters.
The device also includes 12 general-purpose LDOs
providing a wide range of voltage and current
capabilities.
Package
UCSP50L3C
W(Typ) x D(Typ) x H(Max)
3.80mm x 3.80mm x 0.57mm
All Buck Converters and LDOs are fully controllable by
the I2C interface. The BD7185AGWL is very easy to
use in any mobile platforms.
Features
5-channel high-efficiency Buck Converters
(16-step adjustable VO by I2C)
12-channel CMOS-type LDO
(16-step adjustable VO by I2C)
LDO and Buck Converter power ON/OFF control by
I2C interface or external pin.
Power ON/OFF sequence.
32.768kHz OSC and output buffer.
4-to-1 analog switch.
TCXO buffer.
SIM card I/F
I2C compatible Interface.
I2C device address changeable by ADRS pin.
(Device address is “1001011”,”1001100”)
Small and thin CSP package
(3.8mm X 3.8mm height 0.57mm max)
Applications
Smart Phones
Tablets
Mobile Router
Data Transmitter
○Product structure:Silicon monolithic integrated circuit ○This product is not designed protection against radioactive rays
.
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TSZ02201-0Q4Q0AB00010-1-2
8.Apr.2014 Rev.001
1/75
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